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dsp hardware abstraction layer and dsp processor

A hardware abstraction layer, LD-PD technology, applied in the field of communication, can solve the problems of poor portability of DSP waveform components and large differences in underlying interface drivers.

Active Publication Date: 2021-10-15
HUNAN INSTITUTE OF SCIENCE AND TECHNOLOGY +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In wireless communication, the underlying interface drivers of DSP processors are quite different and complex. For different underlying interface drivers and DSP waveform components, the data communication between the two components uses a custom communication interface, resulting in DSP waveform Components suffer from poor portability

Method used

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  • dsp hardware abstraction layer and dsp processor
  • dsp hardware abstraction layer and dsp processor
  • dsp hardware abstraction layer and dsp processor

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Embodiment Construction

[0026] In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

[0027] In order to further describe the technical solutions and effects of the DSP hardware abstraction layer of the present application in detail, the following will first introduce some conventional technologies in this field.

[0028] Conventional DSP waveform component interactions in this field are as follows: figure 1 As shown on the left, Waveform Component 1 and Waveform Component 2 communicate through a custom interface between them. This custom interface is only applicable to Waveform Component 1 and Waveform Component 2. When it is replaced with other Waveform C...

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Abstract

The application relates to a DSP hardware abstraction layer and a DSP processor. The DSP hardware abstraction layer includes an initialization module, a parameter configuration module, a data transceiver module and a message routing distribution module. The parameter configuration module acquires LD-PD mapping parameters and LD-callback function mapping parameters in the hardware abstraction layer, the data transceiver module provides a standard data transceiver interface for external DSP waveform components, coordinates and manages the entire DSP hardware abstraction layer data transceiver process, and the message routing distribution module encapsulates the hardware The abstraction layer message and the route distribution of the hardware abstraction layer message according to the built-in LD-PD mapping table and the LD-callback function mapping table. The entire DSP hardware abstraction layer provides a unified interface for interacting with external DSP waveform components, supports communication between different DSP waveform components, and can significantly improve the portability of DSP waveform components.

Description

technical field [0001] The present application relates to the technical field of communication, in particular to a DSP (Digital Signal Processing, digital signal processing) hardware abstraction layer and a DSP processor. Background technique [0002] With the rapid development of wireless communication technology, software radio technology is becoming more and more mature, and has been widely used in military communication, personal mobile communication and other fields. The software radio system is mainly composed of standardized, generalized and modularized general hardware platforms and software platforms. The core idea is to realize various wireless communication functions by loading software modules with different functions on a common hardware platform. [0003] DSP has become an important part of wireless communication at present. In wireless communication, the underlying interface drivers of DSP processors are quite different and complex. For different underlying i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F13/10H04L25/02
CPCG06F13/102H04L25/026
Inventor 李武吴宇刘奕妤刘新忠谢文武朱鹏施峻武李文彬
Owner HUNAN INSTITUTE OF SCIENCE AND TECHNOLOGY
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