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A gel plastic encapsulated miniature solid state relay

A solid relay and gel technology, applied in relays, electromagnetic relays, detailed information of electromagnetic relays, etc., can solve problems such as damage, distortion, corrosion of the shell, and reduced service life, so as to improve efficiency and reduce the possibility of device damage Effect

Active Publication Date: 2021-03-23
虞再菊
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Due to the development of digitization, multimedia, microelectronics, optoelectronics and power electronics technology, the speed of information processed by corresponding complete machines and systems, such as various communication and network switching equipment, optical communication and its transmission system, remote control and telemetry systems, etc. The faster, the greater the amount of information, and more and more channels. Solid state relays are widely used in military, industrial and household appliances. The development of communication, remote control, and telemetry plays an important role. Traditional solid state relays are small in size during use, and users can easily drop them during installation, causing the terminals to collide with the ground or collide with other objects to cause damage. It is distorted and deformed. At the same time, a large amount of heat will be generated during the conductive operation of the solid state relay, and it is difficult to dissipate heat in time. After a long time of use, the aging and damage of the device will be accelerated. Use will corrode the shell and reduce its service life

Method used

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  • A gel plastic encapsulated miniature solid state relay
  • A gel plastic encapsulated miniature solid state relay
  • A gel plastic encapsulated miniature solid state relay

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Embodiment Construction

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0029] see figure 1 , the present invention provides a technical solution: a gel plastic-encapsulated miniature solid-state relay, including a housing 1, the outer surface of the lower end of the housing 1 is penetrated with a terminal 2, and the corners around the outer surface of the upper end of the housing 1 are fixedly connected with a first sleeve 4 A rubber ring 6 is arranged between the shell 1 and the buffer plate 3, and threaded holes 5 are provided ...

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Abstract

The invention discloses a gel plastic-package miniature solid relay. The gel plastic-package miniature solid relay comprises a shell, wherein a terminal is arranged on an outer surface of a lower endof the shell in a penetrating way, a gel block and a circuit board are arranged at a position, near to an upper end, of an inner surface of the shell, the gel block is arranged at an upper side of thecircuit board, the circuit board is fixedly connected with the gel block, a terminal is fixedly connected with an outer surface of a lower end of the circuit board, a rubber ring is arranged at a position, near to the rubber block, of an outer surface of the upper end of the shell, first sleeves are fixedly connected with surrounding corners of the outer surface of the upper end of the shell, second sleeves are arranged on outer surfaces of upper ends of the first sleeves, and springs are arranged in the first sleeves and the second sleeves. The gel plastic-package miniature solid relay can have a function of vibration reduction, the device maintenance efficiency is effectively improved, moisture is prevented from being stayed on the outer surface of the shell, the corrosion and the damage to the shell are reduced, and the service lifetime of the device is prolonged.

Description

technical field [0001] The invention relates to the field of relays, in particular to a gel plastic encapsulated miniature solid state relay. Background technique [0002] Due to the development of digitization, multimedia, microelectronics, optoelectronics and power electronics technology, the speed of information processed by corresponding complete machines and systems, such as various communication and network switching equipment, optical communication and its transmission system, remote control and telemetry systems, etc. The faster, the greater the amount of information, and more and more channels. Solid state relays are widely used in military, industrial and household appliances. The development of communication, remote control, and telemetry plays an important role. Traditional solid state relays are small in size during use, and users can easily drop them during installation, causing the terminals to collide with the ground or collide with other objects to cause dam...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01H50/02H01H50/12
CPCH01H50/023H01H50/12
Inventor 不公告发明人
Owner 虞再菊
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