Heat sink based on chimney effect

Abstract

The invention provides a heat sink based on the chimney effect. The heat sink comprises a heat source mounting substrate, a heat conducting column, a first thin-wall cylinder, N1 first-layer cooling fins, N2 second-layer cooling fins and a second thin-wall cylinder, wherein a first end of the heat conducting column is connected with the heat source mounting substrate; the first thin-wall cylinderis nested outside the heat conducting column; the N1 first-layer cooling fins are arranged between the heat conducting column and the first thin-wall cylinder radially; the N2 second-layer cooling fins are arranged outside the first thin-wall cylinder radially; the second thin-wall cylinder is nested outside the second-layer cooling fins; the overall structure is that a first-layer chimney air channel, a first thin-wall cylinder chimney air channel, a second-layer chimney air channel and a second thin-wall cylinder chimney air channel are sequentially formed in the radial direction from insideto outside to form a layer-by-layer chimney group structure. The heat sink based on the chimney effect has beneficial effects as follows: by means of multilayer flue nesting structure, horizontal diffusion of airflow is delayed, suction force of the chimney air channels is increased, heat is more effectively taken away from the heat source, and the rapid cooling effect is realized.

Description

technical field [0001] The present disclosure relates to the field of radiator design, in particular to a radiator based on chimney effect. Background technique [0002] In the field of optoelectronics, devices will generate huge heat while they are working normally. For example, during the working process of LED, 80% of the electric power will be converted into heat. If the generated heat cannot be dissipated in a timely and effective manner, it will cause heat accumulation in the device and the temperature will be too high. Excessive temperature will cause the performance of the device to decline, affect the life of the device, and even directly destroy the device. [0003] Existing radiators are divided into active and passive cooling. Active heat dissipation requires external driving force, such as fans and water pumps, to form forced air cooling or liquid cooling to achieve the purpose of heat dissipation. Although the effect is good, additional power consumption is v...

AI Technical Summary

Problems solved by technology

This will lead to an increase in the weight of the radiator, which is not conducive to the development of small and light

In addition, as the size and number of heat sinks increase, the heat sinks will become denser, which cannot ensure smooth air flow, and cannot achieve rapid and effective heat dissipation.

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