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Thermocouple molding method

A molding method and thermocouple technology, applied in the direction of measuring heat, using directly heat-sensitive electric/magnetic element thermometers, using electrical devices, etc., can solve the problem of complex thermocouple molding process and the inability to effectively improve thermocouple performance, etc. problems, achieve the effect of anti-environmental vibration and hot air impact, ensure fast response technical requirements, and strong design

Inactive Publication Date: 2019-05-31
HARBIN UNIV OF SCI & TECH
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The current thermocouple molding process is complex and cannot effectively improve the performance of thermocouples

Method used

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Embodiment Construction

[0017] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0018] see Figure 1-2 , the present invention provides a technical solution: a thermocouple molding method, comprising the following steps:

[0019] A. Integrate the thermocouple of the alumina ceramic substrate into a single chip;

[0020] B. Use two ultra-thin aluminum oxide ceramic sheets with the same triangular structure to encapsulate them in the middle through high-temperature sealing materials to form a "sandwich" structure;

[0021] C. Perform diel...

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Abstract

The invention discloses a thermocouple molding method. The method includes the following steps that: A, aluminum oxide ceramic substrate-based thermocouple monolithic integration is performed; B, twoultra-thin aluminum oxide ceramic sheets of the same triangular structure are encapsulated in the middle through a high-temperature sealing material, so that a sandwich structure is obtained; C, medium film thickening physical isolation protection is performed on the surface of a temperature sensing point, and the sandwich structure is assembled into a protective ceramic tube; and D, the protective ceramic tube with the sandwich structure loaded therein is finally assembled to a metal shell with a hole, and therefore, a thin film thermocouple product is formed. According to the molding methodof the invention, the triangular structure design is adopted; the thermocouple temperature sensing point is set at the vertex angle of the triangular structure, and therefore, the temperature sensingpoint has small heat capacity and small size, and the technical requirement of the sensor for fast response can be satisfied; and since the thermocouple is of a triangle structure, environmental vibration resistance and thermal airflow impact resistance can be maximized, and the robust design of the structure of the sensor can be satisfied.

Description

technical field [0001] The invention relates to the technical field of motors, in particular to a thermocouple forming method. Background technique [0002] Thermocouple is a commonly used temperature measuring element in temperature measuring instruments. It directly measures the temperature, and converts the temperature signal into a thermal electromotive force signal, and converts it into the temperature of the measured medium through an electrical instrument (secondary instrument). The shapes of various thermocouples are often very different due to needs, but their basic structures are roughly the same, usually composed of main parts such as thermal electrodes, insulating sleeve protection tubes, and junction boxes, and are usually associated with display instruments, recording instruments, and electronic regulators. used together with the device. In industrial production process, temperature is one of the important parameters that need to be measured and controlled. I...

Claims

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Application Information

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IPC IPC(8): G01K7/02
Inventor 于广滨陈杰艾仁杰
Owner HARBIN UNIV OF SCI & TECH
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