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Chip high temperature pressure measurement sorting system and high temperature pressure measurement sorting method

A sorting system and chip technology, which is applied in semiconductor/solid-state device testing/measurement, electrical components, circuits, etc., can solve problems such as unsuitable chips, achieve good pressure measurement stability, improve thermal efficiency, improve stability and reliability sexual effect

Active Publication Date: 2020-09-29
HANGZHOU CHANGCHUAN TECH CO LTD
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Problems solved by technology

[0003] The purpose of the present invention is to overcome the deficiency that the current sorting machine is not suitable for high-temperature pressure measurement and sorting of chips, and provide a chip high-temperature pressure measurement and sorting system suitable for high-temperature pressure measurement and sorting of chips and high-temperature pressure measurement and sorting method

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  • Chip high temperature pressure measurement sorting system and high temperature pressure measurement sorting method
  • Chip high temperature pressure measurement sorting system and high temperature pressure measurement sorting method
  • Chip high temperature pressure measurement sorting system and high temperature pressure measurement sorting method

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Embodiment Construction

[0027] The present invention will be further described below in conjunction with the accompanying drawings.

[0028] as attached figure 1 to attach Figure 9 Shown: a high-temperature pressure measurement and sorting system for chips, including: a base 1, two shuttle devices 2 arranged side by side on the upper end of the base 1, eight high-temperature pressure measurement devices 3 arranged on the front side of the shuttle device 2, Eight high-temperature heating devices 4 located on the rear side of the shuttle device 2, and the feeding and receiving device 5 opposite to the left end of the shuttle device 2, are provided with an adsorption assembly 6 located above the feeding and receiving device 5 and one end of the shuttle device 2 The pick-and-place device 7 is provided with a test indexing device 8 for several adsorption assemblies 6 above the shuttle device 2, the high-temperature pressure measuring device 3 and the high-temperature heating device 4.

[0029] The high...

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Abstract

The invention relates to a chip high-temperature voltage-measuring and sorting system comprising a base; two shuttle devices arranged side by side in the front-rear direction on the upper end of the base; a plurality of high-temperature voltage-measuring devices arranged in front of the shuttle devices; a plurality of high-temperature heating devices behind the shuttle devices; a feeding and receiving device opposite to the left ends of the shuttle devices; a material taking and releasing device provided with at least one adsorption component above the one end of the feeding and receiving device and the shuttle devices; and a test transposition device provided with a plurality of adsorption components above the shuttle devices, the high-temperature voltage-measuring devices, and the high-temperature heating devices. The chip high-temperature voltage-measuring and sorting system is suitable for high-temperature voltage measurement and sorting of the chips.

Description

technical field [0001] The invention relates to the field of integrated circuit testing and sorting, in particular to a chip high-temperature pressure measuring and sorting system and a high-temperature pressure measuring and sorting method. Background technique [0002] During the manufacturing process of integrated circuits, it is necessary to test and sort the performance of chips; in order to ensure the normal operation of chips used in high-temperature environments, it is necessary to perform high-temperature pressure measurement and sorting on chips; the existence of traditional sorting machines is not suitable for high-temperature testing of chips. Therefore, it is an urgent problem to design a chip high temperature pressure measurement sorting system and a high temperature pressure measurement sorting method suitable for chip high temperature pressure measurement and sorting. Contents of the invention [0003] The purpose of the present invention is to overcome the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66H01L21/67
Inventor 张新韩笑陈启其章华荣冯雨周陈文艺汪昊范中森程高飞田勇鹏
Owner HANGZHOU CHANGCHUAN TECH CO LTD
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