Semiconductor device and method of manufacture

Abstract

An integrated fan out package on package architecture is utilized along with de-wetting structures in order to reduce or eliminated delamination from through vias. In embodiments the de-wetting structures are titanium rings formed by applying a first seed layer and a second seed layer in order to help manufacture the vias. The first seed layer is then patterned into a ring structure which also exposes at least a portion of the first seed layer.

Description

technical field [0001] Embodiments of the present invention relate to semiconductor devices and methods of manufacturing the same. Background technique [0002] The semiconductor industry has experienced rapid growth due to continuous improvements in the integration level of individual electronic components (eg, transistors, diodes, resistors, capacitors, etc.). For the most part, this improvement in integration density comes from the continuous reduction in minimum feature size (eg, shrinking semiconductor process nodes towards the sub-20nm node), which allows more components to be integrated into a given area. With the recent increase in demand for miniaturization, higher speed and greater bandwidth, and lower power consumption and latency, the need for smaller and more creative packaging techniques for semiconductor die has also increased. [0003] With the further development of semiconductor technology, stacked and bonded semiconductor devices are emerging as effective...

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Problems solved by technology

Such a bonding process utilizes complex

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