Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Thermal removal method and system for PCIE equipment and related device

A heat removal and equipment technology, applied in the server field, can solve the problem of low server maintenance efficiency and achieve the effect of improving heat removal efficiency

Pending Publication Date: 2019-04-23
GUANGDONG INSPUR BIG DATA RES CO LTD
View PDF7 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of this application is to provide a method, system, computer-readable storage medium and server for hot removal of a PCIE device, which solves the problem of low server maintenance efficiency caused by removing hot removal PCIE devices one by one

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Thermal removal method and system for PCIE equipment and related device
  • Thermal removal method and system for PCIE equipment and related device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments It is a part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0036] Please refer to figure 1 , figure 1 It is a flowchart of a thermal removal method of a PCIE device provided in the embodiment of the present application, the thermal removal method includes:

[0037] S101: After receiving the power-off command of the PCIE device, set the first GPIO in the PCH to a low level;

[0038] This step is to receive ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A thermal removal method of the PCIE equipment comprises the steps that after a power-off instruction of the PCIE device is received, a first GPIO in a PCH is set to be a low level; when it is detected that the first GPIO is at a low level, ACPI Hotplug interruption is triggered; when the ACPI Hotplug interruption occurs, the occupied resources of the PCIE equipment are released; and when the release of the occupied resources of the PCIE device is finished, a removal instruction is generated so as to remove the PCIE equipment. In the whole thermal removal process, only the power-off instruction needs to be sent to the server, when thermal removal of the PCIE devices is carried out in batches, the thermal removal efficiency of the PCIE devices is greatly improved, and the maintenance of a server cluster is facilitated. The invention also provides a thermal removal system of the PCIE equipment, a computer readable storage medium and a server, which have the above beneficial effects.

Description

technical field [0001] The present application relates to the field of servers, in particular to a method, system and related devices for heat removal of PCIE equipment. Background technique [0002] In the field of server motherboards, the PCIE interface supports the hot removal function of the device. At present, there are technologies that realize this operation, that is, the PCIE device can be safely removed in the power-on state without causing server abnormalities. However, the current technology is to establish On the basis of complex hardware circuits, the need to increase the heat removal control circuit, the power indicator light and the prompt button greatly increase the complexity of the operation, and the process from pressing the remove button to prompting that the device can be removed also requires Waiting time, when a large number of servers in the computer room need to hot-remove certain PCIE devices, maintenance personnel need to do this for each one in tu...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F13/40
CPCG06F13/4081G06F2213/0026Y02D10/00
Inventor 翟庆伟
Owner GUANGDONG INSPUR BIG DATA RES CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com