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Fixing device for laser chip

A technology for fixing devices and lasers, which is applied to lasers, laser components, semiconductor lasers, etc., can solve problems such as easy blockage of vacuum holes, affect processing efficiency, and deviation from the initial position, so as to reduce the difficulty of loading, ingenious structure, and guarantee The effect of precision

Pending Publication Date: 2019-04-16
STELIGHT INSTR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, there is a chip fixing fixture on the market, which can temporarily fix the chip through the chip groove and the vacuum hole in the chip groove. However, due to the small size of the chip used in the laser, in the actual operation process, not only The vacuum hole is easy to block, and the chip is easy to loosen and deviate from the initial position during the placement, processing and transfer process of different machines, and even bounce off the chip slot, which increases the difficulty of processing and affects its processing efficiency

Method used

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  • Fixing device for laser chip
  • Fixing device for laser chip
  • Fixing device for laser chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Embodiment 1: a kind of fixing device that is used for laser chip, with reference to attached Figure 1-5 , including a stacked bottom plate 11, a steel plate 12, a shrapnel limiting plate 2 and a shrapnel gland 3, the steel plate 12 is provided with a number of positioning grooves 4 for chips 8 to be embedded, and a number of shrapnels 5 are installed on the bottom plate 11 and aligned with the positioning Corresponding setting of slot 4;

[0029] The elastic piece 5 includes a connecting portion 52 installed on the bottom plate 11, a deformation portion 53 bent toward the side of the elastic plate gland 3, and a positioning portion 54 located in the positioning groove 4, and the connecting portion 52 and the positioning portion 54 pass through the deformation portion. 53 connection, the positioning groove 4 has a positioning right angle 41, the end of the positioning part 54 is provided with a right angle positioning notch 51, the two sides of the positioning right an...

Embodiment 2

[0034] Embodiment 2: a kind of fixing device for laser chip, referring to the attached Figure 1-5 , including a stacked bottom plate 11, a steel plate 12, a shrapnel limiting plate 2 and a shrapnel gland 3, the steel plate 12 is provided with a number of positioning grooves 4 for chips 8 to be embedded, and a number of shrapnels 5 are installed on the bottom plate 11 and aligned with the positioning Corresponding setting of slot 4;

[0035] The elastic piece 5 includes a connecting portion 52 installed on the bottom plate 11, a deformation portion 53 bent toward the side of the elastic plate gland 3, and a positioning portion 54 located in the positioning groove 4, and the connecting portion 52 and the positioning portion 54 pass through the deformation portion. 53 connection, the positioning groove 4 has a positioning right angle 41, the end of the positioning part 54 is provided with a right angle positioning notch 51, the two sides of the positioning right angle 41 are in ...

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Abstract

The invention discloses a fixing device for a laser chip. The fixing device comprises a bottom plate, a steel plate, an elastic sheet limiting plate and an elastic sheet gland, wherein the bottom plate, the steel plate, the elastic sheet limiting plate and the elastic sheet gland are stacked up. The steel plate is provided with a plurality of positioning grooves for embedding chips. An elastic sheet comprises a connecting part, a deformation part and a positioning part. The positioning groove is provided with a positioning right angle. A right-angle positioning notch is formed in the end partof the positioning part. Two sides of the positioning right angle are in contact with two adjacent sides of the chip. Two sides of the right-angle positioning notch are in contact with the other two sides of the chip. The elastic sheet gland is in extrusion contact with the deformation part. Strip-shaped through holes corresponding to the positioning grooves are formed in the elastic sheet limiting plate and the elastic sheet gland. A gasket is arranged in each positioning groove. All the gaskets are located below the positioning part of the elastic sheet. The connecting part of the elastic sheet is installed on the bottom plate through a fixing screw. The elastic sheet limiting plate is provided with an adjusting through hole corresponding to the fixing screw. The device is accurate in positioning and is not prone to loosening. Furthermore, the machining efficiency of the small-size chip can be effectively improved.

Description

technical field [0001] The invention relates to a fixing device for a laser chip, which belongs to the technical field of chip processing. Background technique [0002] When using COC (Chip On Porcelain Substrate) technology to make chips, not only the chip body needs to be mounted on the porcelain substrate, but also the chip body and the porcelain substrate need to be connected through gold wires; therefore, in order to achieve high efficiency of the chip For production, it is necessary to fix the chip in the fixture, and use placement and gold wire bonding equipment for batch processing. [0003] At present, there is a chip fixing fixture on the market, which can temporarily fix the chip through the chip groove and the vacuum hole in the chip groove. However, due to the small size of the chip used in the laser, in the actual operation process, not only Vacuum holes are easy to block, and during placement, processing, and transfer of chips to different machines, the chips...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/022H01S3/02
CPCH01S3/02H01S5/023H01S5/0233H01S5/0235
Inventor 徐鹏嵩罗跃浩赵山黄建军胡海洋
Owner STELIGHT INSTR CO LTD
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