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Laser processing method and laser processing system

A technology of a laser processing method and an optical path system, which is applied in the field of laser processing methods and laser processing systems, can solve problems affecting processing efficiency, precision, scanning galvanometer pauses, etc., and achieve the effect of solving insufficient processing accuracy and high processing efficiency

Inactive Publication Date: 2019-04-05
HANS LASER TECH IND GRP CO LTD
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0003] However, in the prior art, the laser scanning galvanometer has a certain format limitation. When it is applied to the processing of large-format products, it is necessary to divide the processed format to form multiple small formats and then process them separately. This brings about the main The problem is that there will be certain accuracy problems in the splicing between small formats, which makes the processing effect not good; and the processing between formats will cause the scanning galvanometer to stop, and it is also necessary to control the opening or closing of the laser , affecting the processing efficiency
The existence of these problems limits the application prospect of laser processing of large format products

Method used

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  • Laser processing method and laser processing system
  • Laser processing method and laser processing system

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Embodiment Construction

[0035] In order to make the objectives, technical solutions and advantages of the present invention clearer, the following further describes the present invention in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

[0036] It should be noted that the terms "setting" and "connection" should be understood in a broad sense. For example, they can be directly arranged and connected, or indirectly arranged and connected through a centered element or a centered structure.

[0037] In addition, if there are terms such as "up", "down", "front", "rear", "left", "right", "vertical", "horizontal", etc., indicating the orientation or positional relationship in the embodiments of the present invention , Which is based on the orientation or positional relationship shown in the drawings or the conventional placement state...

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Abstract

The invention is applicable to the field of laser processing, and discloses a laser processing method and a laser processing system. The laser processing method comprises the following steps of S1, fixedly installing a product to be processed onto a cutting platform capable of driving the product to be processed to move; S2, acquiring positioning information of the product to be processed from a positioning system, and feeding back the positioning information to a control system; S3, processing the received positioning information through the control system, and generating a cutting path according to a preset cutting pattern; and S4, using the control system for controlling a laser beam to move so as to cut the product to be processed along the cutting path, and meanwhile, using the control system for controlling the cutting platform to move along the cutting path, so that the product to be processed is fed at the setting speed. The laser processing system comprises a laser device, a light path system, the cutting platform, the positioning system and the control system. According to the laser processing method and the laser processing system provided by the invention, the large-format product can be accurately and continuously processed, and the processing efficiency is high.

Description

Technical field [0001] The invention belongs to the field of laser processing, and particularly relates to a laser processing method and a laser processing system. Background technique [0002] With the rapid development of laser technology, the application of industrial lasers has become more and more extensive. Laser marking, laser cutting, and laser welding are all mature and extensive application processes, which are widely used in various industries. The continuous upgrading and the continuous progress of the development of optoelectronic technology. In micro-nano manufacturing, laser scanning galvanometers are widely used due to their wide application range, fast processing speed, high processing precision, strong optical path closure and good environmental adaptability, which greatly improves the efficiency and processing quality of laser processing . [0003] However, in the prior art, the laser scanning galvanometer has a certain format limitation. When applied to the pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/70
CPCB23K26/38B23K26/70
Inventor 潘凯庄昌辉冯玙璠陈治贤温喜章黄显东胡凯歌肖骐吴灏淮叶晓龙陈子健尹建刚高云峰
Owner HANS LASER TECH IND GRP CO LTD
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