Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Fluorescent mixture and light-emitting device thereof

A light-emitting device and phosphor technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as poor chemical stability, limited spectral coverage, long-term light decay of light-emitting devices, etc., and achieve the effect of protection

Active Publication Date: 2019-03-29
JIANGSU BREE OPTRONICS CO LTD
View PDF4 Cites 15 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Adopted (Ca,Sr,Ba) 4 al 14 o 25 :Eu 2+ / (Ca,Sr,Ba) 8 MgSi 4 o 16 (F,Cl,Br) 2 :Eu 2+ Green fluorescent powder is used as a luminescent material emitting green light, but the chemical stability of the two green light-emitting fluorescent materials is poor due to the crystal structure, which will lead to a large long-term light decay in the light-emitting device, and at the same time, the distance between the fluorescent powder The coordination efficiency is relatively low, and the spectral coverage is still limited and there is still a big difference from natural light

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Fluorescent mixture and light-emitting device thereof
  • Fluorescent mixture and light-emitting device thereof
  • Fluorescent mixture and light-emitting device thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0110] The LED chip chooses the purple LED chip with the emission peak wavelength of 405nm, the packaging glue chooses silicone resin, and the phosphor combination includes: the blue phosphor chooses the emission peak wavelength of 450nm (Sr, Ba) 5 (PO 4 ) 3 Cl:Eu 2+ Phosphor; yellow-green phosphor selects Y with emission peak wavelength of 530nm 3 (Al,Ga) 5 o 12 : Ce 3+ Phosphors; deep red and near-infrared phosphors select Y with emission peak wavelengths of 691nm and 708nm 3 (Al,Ga) 5 o 12 :Cr 3+ Phosphor; red phosphor chooses CaAlSiN with emission peak wavelength of 650nm 3 :Eu 2+ Phosphor. The mass ratio among the blue phosphor, the yellow-green phosphor, the near-infrared phosphor and the red phosphor is 60.4:15.5:20:4.1. The mass ratio of phosphor powder and packaging glue is 1:0.9. The packaging bracket is SMD type.

Embodiment 2

[0112] The LED chip chooses the purple LED chip with the emission peak wavelength of 410nm, the packaging glue chooses silicone resin, and the phosphor combination includes: the blue phosphor chooses the emission peak wavelength of 450nm (Sr, Ba) 5 (PO 4 )3 Cl:Eu 2+ Phosphor powder; yellow-green phosphor chooses Lu with emission peak wavelength of 535nm 3 Al 5 o 12 : Ce 3+ Phosphors; deep red and near-infrared phosphors select Y with emission peak wavelengths of 691nm and 710nm 3 (Al,Ga) 5 o 12 :Cr 3+ Phosphor; red phosphor chooses CaAlSiN with emission peak wavelength of 655nm 3 :Eu 2+ Phosphor. The mass ratio among the blue phosphor, the yellow-green phosphor, the near-infrared phosphor and the red phosphor is 58:18.5:20.1:3.4. The mass ratio of phosphor powder and packaging glue is 1:0.9. The packaging bracket is SMD type.

Embodiment 3

[0114] The LED chip chooses the purple LED chip with the emission peak wavelength of 420nm, the packaging glue chooses silicone resin, and the phosphor combination includes: the blue phosphor chooses the emission peak wavelength of 450nm (Sr, Ba) 5 (PO 4 ) 3 Cl:Eu 2+ Phosphor powder; yellow-green and deep red phosphors select Y with emission peak wavelengths of 530nm, 691nm and 708nm 3 (Al,Ga) 5 o 12 : Ce 3+ ,Cr 3+ Phosphor; red phosphor chooses CaAlSiN with emission peak wavelength of 655nm 3 :Eu 2+ Phosphor. The mass ratio among the blue phosphor, the yellow-green and near-infrared phosphor and the red phosphor is 73:22.4:4.6. The mass ratio of phosphor powder and packaging glue is 1:0.9. The packaging bracket is SMD type.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a full-spectrum fluorescent mixture and a light-emitting device manufactured by using the same. The fluorescent mixture comprises blue fluorescent powder, green or green-yellowfluorescent powder, red fluorescent powder, and crimson or near-infrared fluorescent powder. A purple-light LED chip is selected for excitation; and a light spectrum of over 700nm in the fluorescent mixture is made up effectively and a natural-light-similar light spectrum is formed.

Description

【Technical field】 [0001] The invention relates to a phosphor mixture for converting an LED light source, in particular to a phosphor mixture for converting a violet LED into a white light source for lighting applications and a light-emitting device thereof. 【Background technique】 [0002] At present, LED white light emitting devices are formed by combining blue LEDs to excite yellow phosphors. The phosphor absorbs a part of the radiated light of the LED and converts it into yellow for color mixing to emit white light. However, in the white color spectrum, the spectral radiation intensity of the blue-green and red parts cannot be fully obtained, which leads to the color reduction of the illuminated object. Poor, that is, the color rendering index is low. [0003] CN 100477256C discloses a light-emitting device, which includes a 250nm-450nm semiconductor excitation light source and red, orange, green and blue phosphor materials, and obtains a full-spectrum light-emitting devi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/50
CPCH01L33/48H01L33/504
Inventor 何锦华符义兵梁超徐俊峰
Owner JIANGSU BREE OPTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com