Rigid fiberglass-free photoelectric printed board and machining method thereof

Abstract

The invention relates to a rigid fiberglass-free photoelectric printed board which can meet the low-reflection machining requirements of a fiberglass-free photoelectric product. The rigid fiberglass-free photoelectric printed board comprises a first PI sheet, N fiberglass-free films and a second PI sheet which are stacked. A single surface of each of the two PI sheets is coated with copper. The two PI sheets and the fiberglass-free films are pre-drilled to form air guiding holes. The method can reduce the residual air bubbles between layers during pressing, reduces the difficulty of laminationprocess and improves the yield.

Description

technical field [0001] The invention relates to the field of PCB manufacturing, in particular to a rigid non-glass fiber photoelectric printed board and a processing method thereof. Background technique [0002] Traditional rigid printed board substrates are mainly composed of reinforcing materials, resins and functional fillers. Generally, according to different reinforcing materials, they can be divided into paper bases, glass fiber cloth bases, composite bases (CM series) and special material bases. (ceramic, metal core base) and other categories, among which glass fiber cloth base is the most widely used as reinforcing material. [0003] Glass fiber cloth has good chemical resistance, electrical insulation and dimensional stability, and can provide good mechanical support for the substrate. It is the core component of rigid printed board processing, but in some special photoelectric In the field of application, the glass cloth will cause photoelectric reflection, causin...

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Problems solved by technology

[0003] Glass fiber cloth has good chemical resistance, electrical insulation and dimensional stability, and can provide good mechanical support for the substrate. It is the core component of rigid printed board processing, but in some special photoelectric In the field of application, the glass cloth will bring photoelectric reflection, cause signal interference, and cannot meet the high-precision quality transmission requirements

[0004] Rigid printed boards are made by lamination of glass-free film. Since the glass-free film is very thin, multiple sheets need to be pressed together to meet the thickness and rigidity requirements. Because the material of a single glass-free film is soft, it is easy to adhere when pre-stacked. Together, it will cause difficulty in degassing between layers, and air bubbles will easily be generated during lamination, resulting in lamination delamination; and the material without glass fiber is relatively soft, which will easily cause burrs when mechanical drilling, affecting the size of the hole and the reliability of the copper connection of the hole

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