Method and system of performing qualification testing for baking module

A test method and qualification technology, which is applied in semiconductor/solid-state device test/measurement, photographic process of patterned surface, instruments, etc., can solve the problem of not being able to predict the thermal uniformity of the hot plate with the best accuracy

Active Publication Date: 2019-03-26
TAIWAN SEMICON MFG CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Unfortunately, existing qualification testing methods do not predict thermal uniformity of hotplates with optimal accuracy
[0004] Thus, while routine qualification testing of hotplates is generally adequate for their intended purpose, it is not entirely satisfactory in every respect

Method used

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  • Method and system of performing qualification testing for baking module
  • Method and system of performing qualification testing for baking module
  • Method and system of performing qualification testing for baking module

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Embodiment Construction

[0020] The following disclosure provides many different embodiments or examples for implementing different features of the invention. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are examples only and not intended to be limiting. For example, in the ensuing description, forming a first feature on or over a second feature may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which the first and second features may be formed in direct contact. An embodiment in which additional features are formed between features such that the first and second features are not in direct contact. Also, the present disclosure may repeat reference numerals and / or letters in various examples. This repetition is for simplicity and clarity, and does not in itself dictate a relationship between the various embodiments and / or configurations discussed. ...

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Abstract

The invention relates to a method and system of performing the qualification testing for a baking module. A test wafer is placed inside a baking module and is baked. Via one or more temperature sensors, a cumulative heat amount delivered to the test wafer during the baking is measured. The measured cumulative heat amount is compared with a predefined cumulative heat amount threshold. In response to the comparing indicating that the measured cumulative heat amount is within the predefined cumulative heat amount threshold, it is determined that the baking module is qualified for actual semiconductor fabrication. In response to the comparing indicating that the measured cumulative heat amount is outside of the predefined cumulative heat amount threshold, it is determined that the baking module is not qualified for actual semiconductor fabrication.

Description

technical field [0001] The present disclosure relates to the field of semiconductor manufacturing, and more particularly to a qualification testing method and system for a baking module. Background technique [0002] The semiconductor integrated circuit (IC) industry has experienced exponential growth. Technological advances in IC materials and design have produced generations of ICs, each with smaller and more complex circuits than the previous generation. During IC evolution, functional density (ie, the number of interconnected devices per chip area) generally increases while geometry size (ie, the smallest component (or line) that can be created using a fabrication process) decreases. This size reduction process generally provides benefits by increasing production efficiency and reducing associated costs. This size reduction also increases the complexity of IC processing and manufacturing. [0003] As the scaling process continues, thermal uniformity control becomes mo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66
CPCH01L22/12H01L22/30H01L21/67248G03F7/70508G03F7/168G03F7/70875H01L21/0274H01L21/67109H01L22/20H05B1/0233H05B3/24H05B3/686
Inventor 赵家峥王忠诚陈俊光
Owner TAIWAN SEMICON MFG CO LTD
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