Filter packaging structure and packaging method

Abstract

The invention provides a filter packaging structure and a packaging method thereof. The method comprises the following steps of 1) providing a high-resistance silicon substrate; 2) forming a groove with a preset depth in a first surface of the high-resistance silicon substrate, and forming a through silicon via in the high-resistance silicon substrate; 3) forming an insulating layer on the inner wall of the through silicon via; 4) forming a conductive through silicon via structure; 5) forming a first ground wire and a second ground wire, and forming a first dielectric layer; 6) forming a second dielectric layer, and forming a third dielectric layer; 7) forming a first transmission line, and forming a second transmission line; and 8) forming a fourth dielectric layer, and forming a third transmission line. The high-resistance silicon substrate is adopted as a chip substrate of a filter; the filter is connected with the substrate through a micro-strip line transmission structure; and theconductive through silicon via structure on the high-resistance silicon substrate leads a lead to the back surface of the high-resistance silicon substrate, so that the lead can be directly connectedwith a packaging substrate in a vertical direction and can be interconnected with other devices in a packaging body.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to a filter packaging structure and a packaging method thereof. Background technique [0002] The rapid development of the wireless communication industry puts forward higher requirements for microwave filters: better performance, smaller size, lighter weight and lower cost. Traditional filters are generally made on PCB substrates or ceramic substrates, but the dielectric constant, thickness of the substrate material, and the size consistency of the filter are poor, especially in relatively high frequency bands, these errors will affect the parameters of the filter cause a relatively large impact. At the same time, the completed discrete components need to be surface-mounted on the PCB together with other active and passive chips. This method often takes up a large area, which creates a huge obstacle to the miniaturization of the RF front-end system. Contents o...

AI Technical Summary

Problems solved by technology

Traditional filters are generally made on PCB substrates or ceramic substrates, but the dielectric constant, thickness of the substrate material, and the size consistency of the filter are poor, especially in relatively high frequency bands, these errors will affect the parameters of the filter have a greater impact

At the same time, the completed discrete components need to be surface-mounted on the PCB board together with other active and passive chips. This method often takes up a large area, which creates a huge obstacle to the miniaturization of the RF front-end system.

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