An electronic product assembly process flow and an assembly lean process design method

A technology of electronic products and process flow, applied in CAD circuit design, computer-aided design, calculation, etc., can solve problems such as reduced attention to process documents, insufficient experience, and operational quality problems, so as to improve production efficiency and stability, The effect of reducing the difference in process quality and good inheritance

Pending Publication Date: 2019-03-08
BEIJING AEROSPACE GUANGHUA ELECTRONIC TECH CO LTD
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Problems solved by technology

At present, there is no standard process table database, which leads to the preparation of process tables and the establishment of data packages to become a large part of process design.
[0007] (2) The process team is younger, and the quality of process design is restricted by human factors
[0008] In the traditional process design mode, the quality and efficiency of process design largely depend on the experience of the craftsmen. Rich process design knowledge and manufacturing resource data, but these knowledge and data have not been systematically sorted out and rationally used, which is not conducive to quick search and repeated use, resulting in incomplete and effective sharing of knowledge resources, slow growth of craftsmen, and limited quality of process design. Human factor constraints
[0009] In addition, there are many standards in the aerospace electronics assembly industry, and the process measures (such as wiring, bonding, protection, glue sealing, etc.) in many standards may involve several types. If you just copy the standard, different craftsmen may choose different methods. process methods, resulting in low consistency of process design for similar products
[0010] In summary, the quality of process design is greatly restricted by human factors
[0011] (3) Traditional process design does not adapt to advanced manufacturing mode and enterprise development needs
Therefore, the traditional process design cannot fully apply to the advanced production mode
[0014] (4) There is a gap in the standardization and quantification of process documents
At the same time, other problems have also been brought about. In order to achieve the purpose of craft refinement, traditional craft documents often have dozens of pages in one book, which may cover everything, but it also brings problems of poor readability and lack of focus. In the end, Operators pay less attention to process documents, resulting in operational quality problems

Method used

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  • An electronic product assembly process flow and an assembly lean process design method
  • An electronic product assembly process flow and an assembly lean process design method
  • An electronic product assembly process flow and an assembly lean process design method

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Embodiment Construction

[0064] The present invention will be described in detail below in conjunction with the accompanying drawings and examples.

[0065] 1. Electronic product assembly process design method

[0066] In electronic products, components are divided into through-hole components and surface mount components according to the installation form; welding methods can be divided into manual welding and automatic welding according to different operation methods. The manual welding method is relatively simple in operation and low in cost. It is relatively low, but it has high requirements for personnel skills, high labor costs, and is not suitable for mass production; especially for surface mount components, such as components with packaging structures such as BGA, it is no longer possible to rely on manual soldering.

[0067] Automatic soldering methods are mainly divided into wave soldering and reflow soldering. Wave soldering is mainly suitable for soldering through-hole components. Reflow ...

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Abstract

The present invention relates to an electronic product assembly process flow and an assembly lean process design method, wherein the method for designing the assembling process flow of electronic products comprises the following steps of first carding the mounting forms of components on the electronic products and establishing the mapping relationship between different mounting forms and the welding process flow; wherein the principles of establishing mapping relationship are as follows that 1) soldering process is established according to component mounting form, in which surface mounting component adopts reflow soldering or manual soldering, and through-hole mounting component adopts wave soldering or selective wave soldering or manual soldering; 2) when the wave soldering and the reflowsoldering of different mounting surfaces are mutually exclusive, that is, when the surface mounting component and the through hole inserting component are located on different mounting surfaces, thesoldering process is further established by component specifications, categories, quantities and qualities; 2 determining a welding flow from that mapping relation according to the mounting form of components on the electronic product to be designed; combining with the pretreatment process and subsequent cleaning and installation process, and determining the assembly process of the whole electronic product.

Description

technical field [0001] The invention relates to the technical field of electronic assembly, in particular to a lean process design method for electronic product assembly. Background technique [0002] With the rapid development of the technology and management level of the electronic assembly industry, the process design level of electronic product assembly has also improved. However, compared with the efficient completion of scientific research and production tasks and the requirements of rapid development, the overall process design level still has a gap. [0003] The bottlenecks currently faced by traditional electronic assembly process design are mainly manifested in the following aspects: [0004] (1) The process design workload is heavy, and there are many repetitive tasks. [0005] With the improvement of aerospace technology management level, the workload of process design is increasing, and the number of various process documents is also increasing. CAPP adopts a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCG06F2119/18G06F30/39
Inventor 赵凡志袁清润张阿莹孙磊边强郎岩朱宁荆宇
Owner BEIJING AEROSPACE GUANGHUA ELECTRONIC TECH CO LTD
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