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Control method for dry ice cleaning of chip packaging mold

A dry ice cleaning and chip packaging technology, applied in cleaning methods and utensils, chemical instruments and methods, etc., can solve the problems of packaging plastic residues, reduce the quality of chip packaging products, etc., and achieve the effect of improving the cleaning effect.

Inactive Publication Date: 2019-03-08
XIAMEN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a method for controlling chip packaging mold dry ice cleaning, aiming at improving the problem that packaging plastic remains on the chip packaging mold and reduces the product quality of chip packaging

Method used

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  • Control method for dry ice cleaning of chip packaging mold
  • Control method for dry ice cleaning of chip packaging mold
  • Control method for dry ice cleaning of chip packaging mold

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Depend on figure 1 As shown, the present embodiment provides a control method for chip packaging mold dry ice cleaning, including the following steps:

[0043] S1. Determine the cleaning parameters of the cleaning equipment according to the degree of contamination of the chip packaging mold to be cleaned, wherein the cleaning equipment includes a dry ice blasting machine, a spray gun for spraying dry ice, and an air compressor that provides compressed air for the dry ice blasting machine The air compressor is connected to the air inlet pipe 60 of the dry ice blasting machine, the spray gun is connected to the air outlet pipe 70 of the dry ice blasting machine, and the dry ice blasting machine provides solid dry ice particles for the spray gun. Wherein, the chip packaging mold is a mold that protects semiconductor chips, gold wires and lead frames together with thermosetting plastics in industry, one of which is as Figure 10 As shown, grooves adapted to the size of the...

Embodiment 2

[0056] The embodiment of the present invention provides a method for controlling dry ice cleaning of a chip packaging mold, and the following dry ice cleaning machine is used:

[0057] refer to Figure 2-8 As shown, this embodiment provides a dry ice blasting machine, including a frame 1 , a feeding device 10 , an ice crushing device 20 , an ice mixing device 30 and a controller 50 . The dry ice blasting machine provided in this embodiment adopts an independent modular design, so that each module is independently installed at each position of the frame 1 and can be disassembled and replaced independently.

[0058] refer to image 3 and Figure 6 As shown, the frame 1 is used to provide a working chamber and support. The frame 1 is provided with a feeding device 10 , an ice crushing device 20 , an ice mixing device 30 and a controller 50 . Detachable sheet metal parts 2 are installed around the frame 1, and each sheet metal part 2 can be disassembled independently without a...

Embodiment 3

[0080] An embodiment of the present invention provides a method for controlling dry ice cleaning of a chip packaging mold, and the following auxiliary brackets can be applied:

[0081] combine Figure 9 , this embodiment provides an auxiliary support, including: a base 81 , a workbench 82 and a lifting mechanism 83 .

[0082] Further, the bottom of the base 81 is provided with an adsorption piece 811 for fixing with external equipment. More preferably, the adsorption member 811 is a magnetic base, and a plurality of magnetic bases are adsorbed and fixed on the chip processing machine, which ensures the quick disassembly of the auxiliary support on the chip processing machine.

[0083] Further, the workbench 82 includes a bottom plate 821 , a sliding mechanism 822 and a moving seat 823 for fixing the spray gun. More preferably, the bottom plate 821 is a U-shaped flat plate. The sliding mechanism 822 is arranged on both sides of the U-shaped plate, and the U-shaped opening ar...

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Abstract

The invention provides a control method for dry ice cleaning of a chip packaging mold. The control method comprises the following steps that S1, according to the pollution degree of the chip packagingmold to be cleaned, cleaning parameters of cleaning equipment are determined, wherein the cleaning equipment comprises a dry ice cleaning machine, a spray gun used for jetting dry ice, and an air compressor used for providing compressed air for the dry ice cleaning machine, the air compressor is connected to an air inlet pipe of the dry ice cleaning machine, the spray gun is connected to an air outlet pipe of the dry ice cleaning machine, and the dry ice cleaning machine provides solid dry ice particles for the spray gun; S2, the spraying direction and the spraying position of the spray gun are adjusted; S3, the chip packaging mold is heated; and S4, the dry ice cleaning machine is started, and cleaning is carried out according to the set cleaning parameters. According to the control method, the cleaning efficiency of the chip packaging mold is improved, and the relatively high economic efficiency and market value are achieved.

Description

technical field [0001] The invention relates to the field of semiconductor mold cleaning, in particular to a control method for dry ice cleaning of chip packaging molds. Background technique [0002] Common mold cleaning methods are high-pressure water gun and sandblasting cleaning, but the high-pressure water gun cleaning method with water as the cleaning medium is easy to rust the mold, and the sandblasting cleaning method with sand as the cleaning medium is easy to damage the equipment and reduce the precision of the mold. The recently developed dry ice cleaning method using dry ice as the cleaning medium uses the physical characteristics of dry ice to clean the dirt on the surface of the mold without damaging the mold. It has the characteristics of environmental protection, economy, long service life, safety and efficiency. [0003] Patent CN105107795B discloses a method for cleaning the surface of electrical components and precision hydraulic parts with dry ice, which i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B7/00B08B13/00
CPCB08B7/0064B08B13/00
Inventor 陈水宣王阳邱一卉王水林张利源
Owner XIAMEN UNIV OF TECH
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