Heat dissipation enhancement packaging structure for frame-type products, and manufacturing method

A technology of packaging structure and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve the problems of low production efficiency in the packaging process, increase the thickness of the package body, etc., and achieve effective heat dissipation and firm connection relationship Effect

Pending Publication Date: 2019-02-01
HUATIAN TECH XIAN
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] The existing technology of enhancing heat dissipation of the package is generally to directly mount the heat sink on the surface of the chip, or mount the heat sink on the surface of the package. The heat sink is either on the upper surface of the chip or around the chip; no matter which method is used above , have the following disadvantages: (1) increase the thickness of the package; (2) the production efficiency of the packaging process is low

Method used

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  • Heat dissipation enhancement packaging structure for frame-type products, and manufacturing method
  • Heat dissipation enhancement packaging structure for frame-type products, and manufacturing method
  • Heat dissipation enhancement packaging structure for frame-type products, and manufacturing method

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Embodiment Construction

[0028] The present invention is described in further detail below in conjunction with accompanying drawing:

[0029] see figure 1 and figure 2 , the invention discloses a packaging structure and a manufacturing method for enhancing heat dissipation of frame products; The frame 1 is composed of several pins 6, and the arrangement of the pins 6 is not required, as long as no contact is required. The upper surface of the frame 1 is fixedly bonded with a chip 3 through the adhesive film 2, and the lower surface of the frame 1 is fixedly bonded with a heat sink 5 through the adhesive film 2; the chip 3 corresponds to the heat sink 5, that is, in the corresponding area of ​​the heat sink 5, The chip 3 is fixedly connected on the upper surface of the frame 1 . The resin 4 wraps around the chip 3, the heat sink 5, and the frame 1; that is, the resin 4 fills each gap of the package structure, and the size of the chip 3 needs to ensure that the lower surface of the chip 3 is in cont...

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Abstract

The invention discloses a heat dissipation enhancement packaging structure for frame-type products, and a manufacturing method. According to the structure, the upper surface of a frame is fixedly provided with a chip, and the lower surface of the frame is fixedly provided with a heat dissipation piece. The lower surface of the heat dissipation piece is exposed. When the packaging structure is in use, the structure can make direct contact with a PCB, thereby enabling the heat generated by the chip to be completely dissipated through the frame and the exposed heat dissipation piece, increasing the heat dissipation area, and improving the heat dissipation efficiency. Because the packaging structure is simple, the packaging can be completed at a time in the manufacturing process, thereby simplifying the conventional packaging process and saving the investment.

Description

【Technical field】 [0001] The invention relates to the field of packaging and heat dissipation, in particular to a packaging structure and a manufacturing method for enhancing heat dissipation of frame products. 【Background technique】 [0002] The existing technology of enhancing heat dissipation of the package is generally to directly mount the heat sink on the surface of the chip, or mount the heat sink on the surface of the package. The heat sink is either on the upper surface of the chip or around the chip; no matter which method is used above , have the following disadvantages: (1) increase the thickness of the package; (2) the production efficiency of the packaging process is low. 【Content of invention】 [0003] The object of the present invention is to overcome the above-mentioned shortcomings of the prior art, and provide a packaging structure and a manufacturing method for enhancing heat dissipation of frame products. In the device, the cooling fins are arranged o...

Claims

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Application Information

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IPC IPC(8): H01L23/31H01L23/367H01L21/56
CPCH01L21/563H01L23/3114H01L23/3121H01L23/3672
Inventor 张锐
Owner HUATIAN TECH XIAN
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