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Array substrate and display device

A technology for array substrates and conductive parts, which is applied in the field of array substrates and display devices, and can solve problems such as fracture, affecting signal transmission, and electrostatic breakdown

Active Publication Date: 2019-01-25
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the projections of the two layers of signal lines 11 and 12 on the substrate are relatively arranged but do not overlap each other, when the signal line 11 or 12 is loaded with an electrical signal, a large amount of electricity will be accumulated at the ends of the two signal lines 11 and 12 that are close to each other. Electrostatic charges are prone to tip discharge, and then electrostatic breakdown occurs in the gap between the two signal lines 11 and 12, causing the part of the connection structure 13 located at the gap to break. Once broken, it is easy to cause the two signal lines to be broken. An open circuit occurs between 11 and 12, affecting signal transmission

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0043] Specifically, the first connection mode of the first conductive part 23 and the second conductive part 24 is as follows: image 3 and Figure 4 As shown, wherein, a part (about half) of the orthographic projection of the first conductive portion 23 on the substrate 20 is located within the range of the orthographic projection of the second conductive portion 24 on the substrate 20, and the other part is located within the range of the orthographic projection of the second conductive portion 24 on the substrate 20. Outside the orthographic projection on the substrate 20. The orthographic projection of the second via hole 27 on the substrate 20 is located within the range of the orthographic projection of the second conductive portion 24 on the substrate 20, and the orthographic projection of the first via hole 26 on the substrate 20 is located within the range of the second conductive portion 24 on the substrate 20. The orthographic projection on the substrate 20 is out...

Embodiment 2

[0045] The second connection method of the first conductive part 23 and the second conductive part 24 is as follows: Figure 5 and Figure 6 As shown, most or all of the orthographic projection of the first conductive portion 23 on the substrate 20 is within the range of the orthographic projection of the second conductive portion 24 on the substrate 20 . The second conductive portion 24 includes at least one slit 241 penetrating through the second conductive portion 24, the orthographic projection of the first via hole 26 on the substrate 20 is within the range of the orthographic projection of the slit 241 on the substrate 20, and the second The projection of the via hole 27 on the substrate is located outside the range of the orthographic projection of the slit 241 on the substrate 20, and the orthographic projection of each first via hole 26 does not overlap with the orthographic projection of the corresponding second via hole 27 and mutually adjacent. and Figure 4 In ...

Embodiment 3

[0049] The third connection method of the first conductive part 23 and the second conductive part 24 is as follows: Figure 7 and Figure 8 As shown, in order to clearly see the structure of the first conductive part 23 and the second conductive part 24 and the connection relationship between the two, in Figure 7 In the figure, the connection structure 25 is represented by a transparent film layer without pattern filling. The first conductive part 23 includes a first comb handle part 23a and a plurality of first comb tooth parts 23b arranged at intervals connected to the first comb handle part 23a, and the area where the first conductive part 23 is located is the first comb handle part 23a, The sum of the areas where the plurality of first comb-tooth portions 23b and the intervals between the first comb-tooth portions 23b are located. The second conductive part 24 includes a second comb handle part 24a and a plurality of second comb tooth parts 24b connected at intervals co...

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Abstract

The invention provides an array substrate. The array substrate comprises a first signal line and a second signal line which are arranged on different insulated and spaced layers of a substrate; one end of the first signal line comprises a first conductive part; one end of the second signal line comprises a second conductive part; the first conductive part and the second conductive part are electrically connected through a connecting structure; and the orthographic projections of an area where the first conductive part is located and an area where the second conductive part is located, on the substrate, are at least partially overlapped. Correspondingly, the invention further provides a display device. According to the array substrate, the disconnection between the signal lines can be reduced, so that the effect of connection between different signal lines can be improved.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to an array substrate and a display device. Background technique [0002] In the manufacturing process of the display device, in order to meet the electrical connection between different layers of signal lines, it is often necessary to set up a transfer structure around the display panel, that is, to set a via hole on the insulating layer between the two layers of signal lines. Connection structures such as indium tin oxide (ITO) connect the two layers of signal lines, and the design of the transfer point directly affects the quality of the electrical connection. [0003] figure 1 It is the connection schematic diagram of the existing two-layer signal line transfer point, figure 2 yes figure 1 Sectional view along line AA. Since the projections of the two layers of signal lines 11 and 12 on the substrate are relatively arranged but do not overlap each other, when the s...

Claims

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Application Information

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IPC IPC(8): G02F1/1362G09F9/00
CPCG02F1/136204G02F1/136286G09F9/00G02F1/13629H01L23/50H01L27/12G02F1/13458G02F2201/506G09G3/20G09G2300/0426H01L27/1244
Inventor 李琳徐彦彬
Owner BOE TECH GRP CO LTD
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