Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Optical detection system

An optical detection and detection technology, which is applied in the direction of optical testing flaws/defects, material analysis through optical means, measuring devices, etc., can solve the problems of defective product outflow, poor accuracy, low efficiency, etc., and reduce the outflow of defective products Probability, the effect of improving detection efficiency and accuracy

Active Publication Date: 2019-01-25
NANTONG FUJITSU MICROELECTRONICS
View PDF2 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The inventors of the present application found in the long-term research process that the above-mentioned existing macroscopic detection has the disadvantages of low efficiency and poor accuracy, and it is easy to cause defective products to flow out

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Optical detection system
  • Optical detection system
  • Optical detection system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0025] see figure 2 , figure 2 It is a schematic structural diagram of an embodiment of the optical detection system of the present application. The optical detection system 2 provided by the present application includes:

[0026] The base 20 includes a first surface 200 and a second surface 202 opposite to each other. The first surface 200 is used to carry the sample 22 to be detected. The material of the base 20 can be plastic, glass, silicon, etc., and ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an optical detection system comprising a base station, a first detecting component and a second detecting component, wherein the base station includes a first surface and a second surface which are back to back, the first surface is used for bearing a to-be-detected sample; the first detecting component and the second detecting component are located on one side of the firstsurface and one side of the second surface of the base station respectively, and detection directions are opposite to the first surface and the second surface of the base station respectively. The first detecting component is used for directly obtaining a first image of the first surface of the to-be-detected sample, the second detecting component is used for obtaining a second image of the second surface of the to-be-detected sample which is back to the first surface through the base station, so as to determine whether the to-be-detected sample has a defect in combination with the first image and the second image of the to-be-detected sample. The optical detection system can improve the efficiency and accuracy of defect detection.

Description

technical field [0001] The present application relates to the technical field of semiconductors, in particular to an optical detection system. Background technique [0002] Wafers, substrates, etc. commonly used in the semiconductor industry, all involve macroscopic inspection of the front and back of wafers or substrates during incoming material inspection, process and final shipment. [0003] For example, if Figure 1a and 1b as shown, Figure 1a It is a structural schematic diagram of an implementation mode of existing macro detection, Figure 1b It is a structural schematic diagram of another embodiment of the existing macro detection. The sample 10 to be inspected (for example, a wafer, a substrate, etc.) is placed on the base platform 12, and under the illumination of the light source 14, whether there is a defect (such as Figure 1a shown); then the sample 10 to be inspected is turned over, and whether there is a defect in the back 102 of the sample to be inspected ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01N21/88G01N21/01
CPCG01N21/01G01N21/88
Inventor 丁万春范伟
Owner NANTONG FUJITSU MICROELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com