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Method for overcoming cutting burrs of flexible substrate

A flexible substrate and burr technology, applied in nonlinear optics, optics, instruments, etc., can solve problems such as product yield decline, ODF impact, high burr, etc.

Inactive Publication Date: 2019-01-15
TRULY SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, due to the limitations of the structure of the CF substrate during pre-cutting, a large number of high burrs will be formed on both sides of the slit after pre-cutting, which will affect the smooth progress of ODF and other processes and reduce the product yield.

Method used

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  • Method for overcoming cutting burrs of flexible substrate

Examples

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Embodiment 1

[0034] The flexible substrate 100 of this embodiment is a CF substrate. After the flexible substrate 100 is pre-cut and before the burrs are not improved, its structure is as follows: figure 1 As shown, the flexible substrate 100 includes a substrate 40 , a flexible substrate 30 and an insulating layer 20 . The substrate 40 and the insulating layer 20 are respectively attached to two sides of the flexible substrate 30 . The insulating layer 20 is made of epoxy resin. The pre-cutting is to cut the flexible substrate 30 and the insulating layer 20 , forming a cut at the cutting place, and the insulating layer produces a burr 10 at the cut after cutting. The polishing disk of this embodiment is a nylon polishing wheel with a diameter of 50 mm, and the particle size of the nylon polishing wheel is 400 mesh.

[0035] Using a polishing method to improve the above-mentioned cutting burrs on the flexible substrate includes the following steps:

[0036] The rotating speed of the polis...

Embodiment 2

[0040] The flexible substrate in this embodiment is a CF substrate. After the flexible substrate is pre-cut and before the burrs are not improved, the flexible substrate includes a base material, a flexible underlayment and an insulating layer. The base material and the insulating layer are respectively attached to both sides of the flexible underlayment. , The insulating layer is made of epoxy resin material. The pre-cutting is to cut the flexible substrate and the insulation layer, and the cutting place forms a cutout, and after cutting, the insulation layer produces burrs at the cutout place. The polishing disk of this embodiment is a nylon polishing wheel with a diameter of 100mm, and the particle size of the nylon polishing wheel is 320 mesh.

[0041] Using a polishing method to improve cutting burrs on flexible substrates includes the following steps:

[0042] The rotational speed of the polishing disc is set to 71 r / min, the humidity of the controlled environment is 60...

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Abstract

The invention relates to a method for overcoming cutting burrs of a flexible substrate, and the method is used to reduce or eliminate burrs generated in a cutting port after pre-cutting of the flexible substrate by polishing. It is verified that a lot of burns are formed in the cutting port in one side surface of the flexible substrate after precutting, the burrs can be treated by polishing, the burrs can be lowered or even eliminated, the flexible substrate can satisfy the requirement for flat surface of the substrate in subsequent procedures, the yield of the flexible substrate as well as subsequent procedures is improved greatly, and the production benefit is improved.

Description

technical field [0001] The invention relates to the technical field of preparation technology of flexible substrates, in particular to a method for improving cutting burrs of flexible substrates. Background technique [0002] In the production process of flexible substrates such as color filter substrates, in order to facilitate the later binding can be carried out smoothly on TFT substrates (Thin Film Transistor, thin film transistor substrates), it is necessary to pre-coat CF substrates (ColorFilter, color filter substrates) ) is pre-cut to expose the bonding position (wire bonding position) on the TFT substrate. After pre-cutting, it goes through ODF process (One Drop Filling, liquid crystal dropping process), and then removes the excess part of the CF substrate after cutting the slivers. [0003] However, due to the limitations of the structure of the CF substrate during pre-cutting, a large number of high burrs will be formed on both sides of the slit after pre-cutting...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B1/00G02F1/1333
CPCB24B1/00G02F1/1333G02F1/133305
Inventor 柳发霖方翠怡董思娜谭晓彬李林
Owner TRULY SEMICON
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