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Thermal processing device for built-in circuit board of single-fiber bidirectional optical transceiver module

An optical transceiver module and single-fiber bidirectional technology, which is applied in the direction of assembling printed circuits, printed circuits, and printed circuit manufacturing of electrical components, and can solve the limitations of equipment quantity, working hours, and positioning methods, increase enterprise labor costs, and increase the number of employees. problems, to achieve the effect of ensuring stability, prolonging service life and improving production efficiency

Active Publication Date: 2020-06-05
PCL SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For products with high precision requirements for placement in large quantities, manual alignment welding is inefficient and requires a lot of manpower, which not only increases the number of employees employed by the enterprise, but also increases the labor cost of the enterprise
However, although hot bar welding is relatively more efficient than manual welding, it is limited by the number of equipment, working hours, and positioning methods. Therefore, an efficient, stable, and practical PCB and FPC welding and placement device is needed

Method used

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  • Thermal processing device for built-in circuit board of single-fiber bidirectional optical transceiver module
  • Thermal processing device for built-in circuit board of single-fiber bidirectional optical transceiver module
  • Thermal processing device for built-in circuit board of single-fiber bidirectional optical transceiver module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Embodiment 1: A thermal processing device for a built-in circuit board of a single-fiber bidirectional optical transceiver module, including a base plate 1, a horizontal cylinder 2, a slide rail 3, a lower pressure seat 4, an upper pressure plate 5, a vertical cylinder 6 and a mounting frame 7. The horizontal cylinder 2 and the slide rail 3 are installed in parallel on the upper surface of the base plate 1, the lower pressure seat 4 is movably installed on the slide rail 3 through a movable plate 8, and the mounting frame 7 is installed on the upper surface of the base plate 1, The fixed part of the vertical cylinder 6 is fixedly installed on the outer surface of the mounting frame 7, and the upper pressing plate 5 is fixedly connected with the movable part 602 of the vertical cylinder 6 through a connecting plate 9;

[0027] An indenter 13 is arranged below the upper platen 5, and the side surface of the indenter 13 is provided with a plurality of through holes for the ...

Embodiment 2

[0032] Embodiment 2: A thermal processing device for a built-in circuit board of a single-fiber bidirectional optical transceiver module, including a base plate 1, a horizontal cylinder 2, a slide rail 3, a lower pressure seat 4, an upper pressure plate 5, a vertical cylinder 6 and a mounting frame 7. The horizontal cylinder 2 and the slide rail 3 are installed in parallel on the upper surface of the base plate 1, the lower pressure seat 4 is movably installed on the slide rail 3 through a movable plate 8, and the mounting frame 7 is installed on the upper surface of the base plate 1, The fixed part of the vertical cylinder 6 is fixedly installed on the outer surface of the mounting frame 7, and the upper pressing plate 5 is fixedly connected with the movable part 602 of the vertical cylinder 6 through a connecting plate 9;

[0033] An indenter 13 is arranged below the upper platen 5, and the side surface of the indenter 13 is provided with a plurality of through holes for the ...

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PUM

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Abstract

The invention discloses a hot-working device used for a single-fiber bidirectional optical transceiver module built-in circuit board. The device includes a base plate, a horizontal air cylinder, a slide rail, a lower press seat, an upper press plate, a vertical air cylinder and an installation rack; the horizontal air cylinder and a slide rail are parallelly installed on the upper surface of the base plate; the lower press seat is movably installed on the slide rail through a movable plate; a pressure head is parallelly provided with multiple gate holes for airflow to go through; the upper surface of the movable plate is provided with multiple screwed holes; a damping block in matching arrangement with hydraulic plungers is installed on the upper end of a slide part of the vertical air cylinder; an installation column is fixedly arranged on the upper surface of the base plate; a clamping block is fixedly connected to the side surface of a focusing mechanism through a connecting block;and a CCD imaging module is vertically installed in the central through hole of the clamping block. Through the arrangement of the hydraulic plungers matching the damping block, buffer force exists during the pressing of the pressure head with the upper press plate, so that the situations of the damaging and crushing of a circuit board caused by excessive pressure can be avoided, pressing qualitycan be guaranteed, unnecessary wastes can be avoided, resources can be saved, and production efficiency can be enhanced.

Description

technical field [0001] The invention relates to the technical field of electronic products, in particular to a thermal processing device for a built-in circuit board of a single-fiber bidirectional optical transceiver module. Background technique [0002] With the development of optical fiber communication, the optical transmission system puts forward higher requirements for optical modules. Optical modules are gradually developing in the direction of low cost, multiple types, and high compatibility. GBIC (Gigabit Interface Converter, Gigabit Interface Converter) is an interface device that converts gigabit electrical signals into optical signals. GBIC is designed to be hot-swappable. GBIC is an interchangeable product that meets international standards. . Gigabit switches designed with GBIC interface occupy a large market share in the market because of their flexible interchangeability. With the development of optical communication technology, SFP (Small Form-factor Plug...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B6/42H05K3/36
CPCG02B6/4237G02B6/4281H05K3/361
Inventor 余文兵陈振伟高萍萍朱晶韩泽祥
Owner PCL SUZHOU
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