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Encapsulation method and display panel

A display panel and packaging method technology, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems that the packaging film cannot effectively block water vapor, and the display panel substrate is corroded and damaged, so as to reduce the probability of peeling phenomenon , tight combination, quality assurance effect

Active Publication Date: 2018-12-18
BOE TECH GRP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In view of the shortcomings of the existing methods, this application proposes a packaging method and a display panel to solve the technical problem in the prior art that the packaging film cannot effectively block water vapor and cause the substrate in the display panel to be corroded and damaged

Method used

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  • Encapsulation method and display panel
  • Encapsulation method and display panel
  • Encapsulation method and display panel

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Embodiment Construction

[0035] The present application is described in detail below, and examples of embodiments of the present application are shown in the drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. Also, detailed descriptions of known technologies will be omitted if they are not necessary to illustrate the features of the present application. The embodiments described below by referring to the figures are exemplary only for explaining the present application, and are not construed as limiting the present application.

[0036] Those skilled in the art can understand that, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings as commonly understood by those of ordinary skill in the art to which this application belongs. It should also be understood that terms, such as those defined in commonly used dictionaries, should be ...

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Abstract

An embodiment of the present application provides an encapsulation method and a display panel. The encapsulation method includes: providing a substrate to be encapsulated and a cover plate; forming aninorganic encapsulation layer on the substrate to be encapsulated; forming an intermediate layer containing a photosensitive material on the inorganic encapsulation layer, and irradiating the intermediate layer with light of a preset wavelength to form a bonding layer; forming an organic encapsulation layer on the bonding layer; implementing a preset temperature treatment process, so that a photosensitive material in the bonding layer is bonded with the inorganic encapsulation layer and the organic encapsulation layer respectively to finally form an encapsulation film. The bonding layer allows the inorganic encapsulation layer and the organic encapsulation layer to be bonded more closely, the capability of the encapsulation film of withstanding external force is improved, the invention reduces the probability of a stripping phenomenon of the interface between the inorganic encapsulation layer and the organic encapsulation layer, and further improves the blocking effect of the encapsulation film. The encapsulation film is formed on the substrate in the display panel by adopting the encapsulation method, so that moisture and oxygen can be effectively prevented from contact with thesubstrate, and corrosion damage to the substrate can be avoided.

Description

technical field [0001] The present application relates to the technical field of display panel packaging, and in particular, the present application relates to a packaging method and a display panel. Background technique [0002] OLED (Organic Light-Emitting Diode, organic light-emitting semiconductor or organic electro-laser display) is a display lighting technology that has gradually developed in recent years. It is widely used due to its advantages of high response, high contrast and flexibility. Especially in the field of display, the application prospect of OLED is very broad. For example, the current booming display panel generally adopts related technology of OLED. [0003] Since OLED devices are prone to corrosion and damage under the action of water vapor and oxygen, effective packaging must be implemented for display panels using OLED devices. In order to adapt to the flexible feature of the display panel, the packaging film of the display panel also needs to have...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L27/32
CPCH10K59/00H10K50/84H10K50/844
Inventor 王琳琳
Owner BOE TECH GRP CO LTD
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