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Coaxial packaged laser and optical module

A laser, coaxial technology, used in lasers, laser parts, semiconductor lasers, etc., can solve problems such as large parasitic parameters, and achieve the effect of solving heat dissipation, shortening length, and ensuring heat dissipation effect.

Inactive Publication Date: 2018-12-11
HISENSE +1
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  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to solve the technical problem of excessive parasitic parameters caused by the bonding of the laser chip to the pin of the coaxial package laser with a rate of 25Gb / s and higher in the prior art, and to provide a coaxial package laser Lasers and Optical Modules

Method used

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  • Coaxial packaged laser and optical module

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Embodiment Construction

[0020] In order to further illustrate the principle and structure of the present invention, preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0021] see figure 1 , in the existing package, the laser chip 1 is directly arranged on the transitional heat sink 5 . The positive and negative poles of the laser chip 1 need to be connected to the pin 3 of the tube base through the wire 3, and the gap between the pin 3 and the tube base 4 is sealed by glass, and the purpose of insulating the pin 3 and the tube base 4 is achieved, so as to realize the laser The positive electrode of the chip and the negative electrode of the laser chip are electrically connected to the outside separately.

[0022] In high-speed devices, the laser chip generates a lot of heat, and the heat dissipation of the transitional heat sink cannot meet the heat dissipation of the laser chip, resulting in the concentration of heat on the l...

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Abstract

The invention discloses a coaxial packaged laser which comprises a base with at least two pins, a laser chip and a semiconductor cooler arranged on the surface of the base. The surface of the semiconductor cooler is provided with a heat conduction substrate, and the laser chip and a third conducting layer are arranged on the surface of the heat conduction substrate, and the laser chip is in wire bonding connection with the third conducting layer. A first base body and a second base body are arranged on the surface of the base and located on the two sides of the heat conduction substrate. A first conductive layer is arranged on the surface of the first substrate, and the first conductive layer is welded with one pin of the base, the first conductive layer is in wire bonding connection withthe third conductive layer. A second conductive layer is arranged on the surface of the second substrate, and the second conductive layer is welded with the other pin of the base, and the second conductive layer is in wire bonding connection with the third conductive layer. The invention further provides an optical module. The electric connection mode of the laser chip and the pin and the matchingarrangement of the semiconductor cooler shorten the length of the whole wire bonding, ensure the heat dissipation of the high-speed laser chip and facilitate the transmission of high-speed signals.

Description

technical field [0001] The invention relates to an optical packaging device for high-speed application, in particular to a coaxial packaged laser and an optical module. Background technique [0002] As the society has higher and higher requirements for the quality of data, images and other information, the requirements for the transmission rate of the optical module are also higher and higher, and the key device in the optical module is the laser emitting component. In order to meet the high transmission rate of the laser emitting component Speed ​​requirements not only require the transmission rate of the laser chip itself to meet the requirements of high-speed applications, but also must have a packaging technology that can support high-speed packaging. At present, the key technology of laser chips used for 25Gb / s transmission rate has been broken through and mass-produced. As for the packaging technology of high-speed devices, there are mainly two packaging forms: XMD and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/024H01S5/042
CPCH01S5/02415H01S5/042
Inventor 张玲艳
Owner HISENSE
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