Circuit board module, electronic device, display screen device and assembly method thereof

A technology for circuit board components and electronic equipment, applied in the directions of printed circuit components, electrical components, printed circuits, etc., can solve the problems of reducing product yield, affecting product quality, damage and breakage of flexible circuit boards, and achieving comprehensive product quality. Improve the efficiency and avoid the effect of easy damage

Active Publication Date: 2018-12-07
OPPO CHONGQING INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, during the above-mentioned bonding operation, the flexible circuit board may be pulled, arched or bent, which may easily cause damage and breakage of the flexible circuit board, affect product quality, and reduce product yield

Method used

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  • Circuit board module, electronic device, display screen device and assembly method thereof
  • Circuit board module, electronic device, display screen device and assembly method thereof
  • Circuit board module, electronic device, display screen device and assembly method thereof

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Embodiment Construction

[0025] The application will be described in further detail below in conjunction with the accompanying drawings and embodiments. In particular, the following examples are only used to illustrate the present application, but not to limit the scope of the present application. Likewise, the following embodiments are only some of the embodiments of the present application but not all of them, and all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present application.

[0026] Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The occurrences of this phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is understoo...

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Abstract

The present application discloses a circuit board module, an electronic device, a display screen device and an assembly method thereof. The circuit board module comprises a substrate; an integrated circuit disposed on the substrate; a first flexible circuit board having one end lapped on the substrate; and a second flexible circuit board having one end lapped on the substrate. Therefore, it is possible to avoid a situation that the flexible circuit boards are liable to damage in a direct bonding process of the integrated circuit and the flexible circuit boards, so that the overall product yield is improved.

Description

technical field [0001] The present application relates to the technical field of electronic equipment, in particular to a circuit board assembly, electronic equipment, a display device and an assembly method thereof. Background technique [0002] With the development of science and technology, electronic devices such as smart phones have gradually become the necessities of people's life. It has become a trend for electronic equipment to adopt narrow bezels. In order to achieve narrower lower bezels, some electronic equipment manufacturers adopt the packaging method of directly attaching chips to flexible circuit boards, and then take advantage of the bendable characteristics of flexible circuit boards. The flexible circuit board is bent to reduce the width of the lower frame. [0003] However, the flexible circuit board may be pulled, arched or bent during the above lamination operation, which may easily cause damage and fracture of the flexible circuit board, affect produc...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K1/14G09F9/00
CPCG09F9/00H05K1/028H05K1/147
Inventor 陆忠恒
Owner OPPO CHONGQING INTELLIGENT TECH CO LTD
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