Test pin module and test contact formed by test pin modules

Abstract

The present invention discloses a test pin module. The test pin module comprises at least two sets of test pins arranged side by side, the test pin module comprises a first test pin main body (1) anda second test pin main body (2) arranged at the upper portion of the first test pin main body (1); the first test pin main body (1) is provided with a first test pin head (3), the second test pin mainbody (2) is provided with a second test pin head (4) located at the right side of the first test pin head (3), and the first test pin main body (1) and the second test pin main body (2) are providedwith test board contact surfaces (5). The test pin module and the test contact formed by test pin modules are simple in structure and low in cost, the two test pin heads of the test pin sets are in contact with the product pins for test, the test pin module at least comprises two sets of the test pins arranged side by side, at least four test pin heads are in contact with the product pins when test so as to greatly reduce the problem of the failed contact of the test pin module and the product pins so as to improve the accuracy of the product test result and improve the product percent of pass, and therefore, the test pin module and the test contact formed by test pin modules are suitable for promotion and usage.

Description

technical field [0001] The invention relates to a mechanical structure used for testing semiconductor products, in particular to a test contact sheet composed of the same. Background technique [0002] Before the semiconductor product manufacturing process is completed, it needs to enter the final test stage. The final test is to use the matching between the test machine (Tester), sorter (Handler), test board (DUT Board) and test contact piece (Test Finger) Combination to test each product, the test line of the tester is connected to the line on the test board, the line on the test board is connected to one end of the test pin of the test contact piece, and the other end of the test pin is directly connected to the pin of the semiconductor product Contact, and then test the product. During the manufacturing process, burrs are easily generated on the contact surface of the pin and the test pin, and at the same time, the contact surface of the pin is also easy to generate irr...

AI Technical Summary

Problems solved by technology

[0003] One of the purposes of the present invention is to provide a test pin assembly to solve the problem of contact failure between test pins and product pins when testing semiconductor products.

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