Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Semiconductor wafer cleaning and drying device

A technology for drying equipment and semiconductors, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc. It can solve the problems of easy fragments and contamination of wafers, residual water marks on wafers, and potential safety hazards, so as to reduce fire safety Hidden dangers, preventing damage to wafers, and reducing production costs

Inactive Publication Date: 2018-11-16
扬州思普尔科技有限公司
View PDF6 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the existing semiconductor wafer cleaning and drying problems that the wafer is easily fragmented and stained, there are residual water marks on the wafer surface, and there are hidden safety hazards in the processing process, the purpose of the present invention is to provide a semiconductor wafer cleaning and drying equipment. It has the advantages of combining cleaning and dehydration, without heat treatment, and reducing production costs

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor wafer cleaning and drying device
  • Semiconductor wafer cleaning and drying device
  • Semiconductor wafer cleaning and drying device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] Specific embodiments of the present invention will be described below in conjunction with the accompanying drawings.

[0030] Such as Figure 1-6 As shown, a semiconductor wafer cleaning and drying equipment includes an equipment main body 1, a water tank 2, a cover tank 3, a cover tank moving mechanism 4 connected to the cover tank 3, a wafer placing flower basket 5 movable in the water tank 2, an upper and lower The running mechanism 6, the IPA bottle 7 and the control panel 8, the water tank 2 is fixed on the equipment main body 1, the height of the bottom surface of the cover tank 3 is consistent with the height of the top of the water tank 2, the cover tank moving mechanism 4 is located at both ends of the water tank 2, the water tank 2 An overflow tank 21 is fixed on the outside, a cover plate 22 is fixed above the overflow tank 21, a waste water discharge pipe 211 is provided at the bottom of the overflow tank 21, an overflow port 23 communicating with the overfl...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a semiconductor wafer cleaning and drying device and in particular relates to the technical field of semiconductor wafer cleaning. The semiconductor wafer cleaning and drying device comprises a device body, a water tank, a cover tank, a cover tank moving mechanism connected to the cover tank, a wafer placement basket movably disposed in the water tank, a up-down running mechanism, an IPA bottle and a control panel. The water tank is fixed the device body. The cover tank moving mechanism is located at the two ends of the water tank. An overflow tank is fixed to the outerside of the water tank. The water tank is provided with an overflow port communicating with the overflow tank. A basket fixing bracket is fixed in the water tank. A resistivity probe interface is arranged on the water tank. A drain valve is arranged at the bottom of the water tank. The up-down running mechanism includes a mechanical arm in the water tank and a mechanical arm driving mechanism fordriving the mechanical arm. The mechanical arm driving mechanism is located at a side of the cover tank moving mechanism. The IPA bottle communicates with the inside of the cover tank through a pipe.A nitrogen gas inlet pipe also communicates with the inside of the cover tank. The semiconductor wafer cleaning and drying device combines cleaning and dehydration, avoids heating treatment and reduces production cost.

Description

technical field [0001] The invention belongs to the technical field of semiconductor wafer cleaning, and in particular relates to semiconductor wafer cleaning and drying equipment. Background technique [0002] In the semiconductor wafer cleaning process, at present, the water tank structure is mainly used for batch cleaning, and then transferred to the drying equipment for dehydration and drying of the wafer. During the transfer process, due to various uncertain factors Secondary contamination will be caused to the cleaned wafer, and two pieces of equipment are required to complete the cleaning and drying process, which increases equipment procurement and manufacturing costs. [0003] The first semiconductor wafer dehydration and drying equipment on the market is a centrifugal spin dryer. The main principle is to place the wafer on a high-speed rotating fixture, and use the centrifugal force generated by the high-speed rotation to dry the water on the wafer surface. With h...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67034H01L21/67057
Inventor 刘芳军
Owner 扬州思普尔科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com