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Workbench for de-bonding bonded sheet product and clamping method

A workbench, workbench technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of reduced suction, inability to fully fit, ignoring small batch processing, etc., to avoid inconvenience and avoid positioning. Unstable, versatile effect

Pending Publication Date: 2018-11-13
ZHEJIANG MICROTECH MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the carrier in the above-mentioned prior art has certain limitations due to its own structural characteristics.
In other words, when the flatness of the above-mentioned products or slides is poor, such as products after plastic packaging, it will result in that the product or slides with poor flatness cannot be completely attached to the work surface of the stage. , so there will be air leakage, which will reduce the suction force of the suction hole on the product, which will cause the product to fail to attach to the carrier normally, or cause the product and the carrier to fail due to the small suction force. Unable to debond normally
[0005] In addition, it is worth mentioning that when the slide is attached and adsorbed to the stage of the prior art, the surface accuracy of the slide can be improved to improve the adsorption effect, or a thicker slide can be selected to complete the process through a traditional chuck. Clamping, although the above-mentioned processes will increase the processing cost and reduce the production efficiency, but in the case of small batch processing without considering the production cost, the purpose of debonding between the product and the carrier can still be achieved
However, there is no better solution in the prior art when the product and the carrier need to be bonded and adsorbed.
Therefore, this carrier of the prior art can only be aimed at specific products and slides in the actual production process, and its versatility is poor

Method used

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  • Workbench for de-bonding bonded sheet product and clamping method
  • Workbench for de-bonding bonded sheet product and clamping method
  • Workbench for de-bonding bonded sheet product and clamping method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] The invention provides a workbench for debonding after bonding of thin sheet products, which includes such as figure 1As shown in the carrier 1, the carrier 1 is placed in a horizontal direction as shown in the figure, and it is characterized in that: the carrier 1 is provided with a reference surface 2 and at least one suction cup group 3, when the product 4 is placed in the vertical direction When placed on the stage 1 from top to bottom, the suction cup group 3 touches the product 4 before the reference surface 2 and is attracted to the back side 4.1 of the product 4. In other words, the product 4 moves vertically from top to bottom. In the process of lowering, first touch the part of the suction cup group 3 above the carrier 1, and when the suction cup group 3 sucks the product, the suction cup group 3 drives the product 4 that is attracted to the suction cup group 3 to move toward the position of the reference surface 2 Until the rear side 4.1 of the product 4 abut...

Embodiment 2

[0039] The structure is basically the same as that of Embodiment 1, the difference is that the suction cup set 3 includes several vacuum suction nozzles 3.1 made of elastic material, and one end of the vacuum suction nozzles 3.1 along its own length direction is installed on the carrier 1 , the other end of the vacuum nozzle 3.1 is provided with an opening 3.2, which is used to attach to the back side 4.1 of the product 4. As mentioned above, when the vacuum suction nozzle 3.1 made of elastic material is used for the suction cup group 3, specifically, the corrugated suction nozzle can be used, and the suction force between the vacuum suction nozzle 3.1 and the back side 4.1 of the product 4 increases, At the same time, it also drives the product 4 along figure 1 The thickness direction of the middle stage 1 moves downward until the back of the product 4 is attached to the upper surface of the stage 1. Of course, if the stage 1 is provided with an additional reference surface 2...

Embodiment 3

[0041] The structure is basically the same as that of the second embodiment, the difference is that: the stage 1 is provided with a worktable, and the suction cup set 3 and the reference plane 2 are both located on the worktable of the stage 1 . Such as figure 1 As shown, the working table is the upper end surface of the carrier 1 , and the entire working table is used as the reference plane 2 as a whole. Certainly, the reference plane 2 may be an additional reference plate or a reference block independently provided on the worktable, or may be the upper end surface of the cutting platform 1 so that part of the worktable serves as the reference plane 2 .

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Abstract

The invention discloses a workbench for de-bonding a bonded sheet product. The workbench comprises a carrying platform and is characterized in that the carrying platform is provided with a datum planeand at least one sucker group; when the product is placed on the carrying platform, the sucker groups contact with the products before the datum plane contacts with the product and suck the back of the product, and the sucker groups drive the product on the sucker groups to move towards the datum plane until the back of the product is abutted against the datum plane. The workbench has the advantages that the surface of the product can be well attached to the workbench through the suckers, good sucking can be achieved even if the surface of the product is warped or the surface precision of theproduct is poor, and the product can be well fixed and positioned on the carrying platform through the datum plane; the workbench can clamp the product poor in flatness and thus is high in universality during de-bonding.

Description

technical field [0001] The invention relates to the technical field of preparation of related accessories for integrated circuits, in particular to a workbench and a clamping method for unbonding and debonding of sheet products after bonding. Background technique [0002] Thin sheet products often need to be bonded to a carrier before surface processing, such as thinning, etching, etc., thereby enhancing the strength of the product, reducing or avoiding defects such as product fragmentation, and improving the pass rate of the product. The above-mentioned process is widely used in the semiconductor processing industry, so the definition in the industry is used to call it the product bonding process. Of course, after the surface processing of the bonded product is completed, it is necessary to separate the product from the carrier, and this process is called the debonding process. [0003] The unbonding process is simply to fix the product and the carrier through the stage an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/683
CPCH01L21/67011H01L21/683H01L21/6838
Inventor 唐昊尹明黄超云
Owner ZHEJIANG MICROTECH MATERIAL CO LTD
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