Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Heat dissipation component and electronic device

A technology for heat dissipation components and electronic devices, applied in electrical components, electrical digital data processing, digital data processing components, etc., can solve the problems of chip power consumption, temperature rise of electronic equipment, etc., to avoid local overheating, shorten distance, prevent damage effect

Inactive Publication Date: 2018-11-09
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
View PDF9 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The development of chips not only brings about the problem of power consumption, but also due to the thinning and thinning of electronic devices, the heat of chips is sealed inside the electronic equipment, which makes the temperature of electronic equipment rise.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat dissipation component and electronic device
  • Heat dissipation component and electronic device
  • Heat dissipation component and electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It should be understood that the specific embodiments described here are only used to explain the present application, but not to limit the present application. In addition, it should be noted that, for the convenience of description, only some structures related to the present application are shown in the drawings but not all structures. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

[0018] The terms "first", "second", etc. in this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "include" and "have", as well as any variations thereof, are intended to cover a non-e...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a heat dissipation component and an electronic device. The heat dissipation component comprises a circuit board, a heat source chip, a shielding case and a heat pipe, wherein the heat source chip is disposed on the circuit board; the shielding case is disposed on the circuit board and encircles the heat source chip; an insulating silica gel is filled in a shielding space formed by the shielding case; a side wall of the shielding case is provided with a via hole; an evaporation section of the heat pipe is disposed in the insulating silica gel; a condensation section extruded from the via hole and is used for discharging heat of the heat source chip. Through the abovementioned manner, on the one hand, a distance between the heat pipe and the heat source chip is shortened, and the heat can be better absorbed; on the other hand, the problem of local overheating of the electronic device is avoided and the damage of components caused by local overheating is prevented.

Description

technical field [0001] The present application relates to the technical field of mobile terminals, in particular to a heat dissipation component and an electronic device. Background technique [0002] The interior of an electronic device generally includes a control chip (ie, a core processor). With the diversification and intelligence of its functions, the requirements for the chip are also very high. The main frequency of current chips is generally 1GHz, 2GHz or even higher, and dual-core, quad-core and even eight-core chips are very common. [0003] The development of chips not only brings about the problem of power consumption, but also due to the thinning and thinning of electronic devices, the heat of chips is sealed inside the electronic equipment, which makes the temperature of electronic equipment rise. Contents of the invention [0004] A technical solution adopted in this application is to provide a heat dissipation assembly, which includes: a circuit board; a ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20H05K7/20
CPCG06F1/203H05K7/20336
Inventor 田汉卿
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com