Reaction chamber and semiconductor processing equipment

A technology of reaction chamber and concave part, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of high processing accuracy and cost, and increase the complexity of equipment

Active Publication Date: 2018-11-02
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the double-layer Faraday shield increases the complexity of the equipment, and the processing accuracy and cost are high

Method used

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  • Reaction chamber and semiconductor processing equipment
  • Reaction chamber and semiconductor processing equipment
  • Reaction chamber and semiconductor processing equipment

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Embodiment Construction

[0028] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the reaction chamber and semiconductor processing equipment of the present invention will be further described in detail below with reference to the drawings and specific implementation methods.

[0029] This embodiment provides a reaction chamber, the reaction chamber includes a vacuum-sealed barrel and a Faraday shield embedded in the vacuum-sealed barrel, the Faraday shield is provided with a slit running through the thickness of the Faraday shield, wherein the vacuum-sealed barrel The inner wall of the inner wall is provided with a recess at a region corresponding to the slit, and the recess is used to accommodate process by-products from the slit of the Faraday shield. In the reaction chamber, a recess is formed on the inner wall of the vacuum-sealed barrel to form an accommodating space for by-products deposited on the vacuum-sealed barrel during the p...

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Abstract

The invention belongs to the technical field of semiconductor processing, and particularly relates to a reaction chamber and semiconductor processing equipment. The reaction chamber comprises a vacuumsealing tub and a Faraday shielding case embedded in the vacuum sealing tub; the Faraday shielding case is provided with a slit penetrating through the thickness thereof; a recess is arranged in a region corresponding to the slit on the inner wall of the vacuum sealing tub; and the recess is used for holding a technological by-product from a slit of the Faraday shielding case. The reaction chamber is simpler in structure and easier to process; as the recess can hold the technological by-product from the slit of the Faraday shielding case, the problem of long cleaning maintenance period of thevacuum sealing tub is effectively solved; moreover, the coupling efficiency of the electromagnetic energy and the plasma is higher under an equal condition; correspondingly, the semiconductor processing equipment formed on such a basis has longer cleaning maintenance period and better processing effect.

Description

technical field [0001] The invention belongs to the technical field of semiconductor processing, and in particular relates to a reaction chamber and semiconductor processing equipment. Background technique [0002] The Faraday shield is often used in the precleaning (Preclean) device of the inductively coupled plasma to reduce the capacitive coupling components of the plasma and increase the plasma density. Especially when etching (sputtering) a wafer coated with a metal (Metal) film, the Faraday shield is an essential component, and also plays a role in reducing metal deposition on the ceramic tub (Ceramic tub). [0003] Typically, the Faraday shield is provided with multiple slots to reduce eddy current losses and allow electromagnetic field energy to couple into the plasma. The sputtered metal particles can pass through the slits of the Faraday shield and deposit on the ceramic barrel, forming a thin film between the slits. When the metal film reaches a certain thicknes...

Claims

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Application Information

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IPC IPC(8): H01L21/67
CPCH01L21/67213
Inventor 王文章陈鹏
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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