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A kind of semiconductor diode production process

A production process and diode technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as low product applicability, quality problems, and pin scratches

Active Publication Date: 2019-08-20
吉林瑞能半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this solution, the pins rub against the lower mold during bending, which leads to scratches on the pins, which in turn leads to quality problems; the bending angle of the pins cannot be adjusted, and the bending fillet of the pins cannot be adjusted, which leads to the inapplicability of the product. Low stability; the dust in the positioning groove cannot be cleaned in time after bending

Method used

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  • A kind of semiconductor diode production process
  • A kind of semiconductor diode production process
  • A kind of semiconductor diode production process

Examples

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Embodiment approach

[0038] As an embodiment of the present invention, the bending module 3 includes a positioning plate 31, an adjusting plate 32, a No. 1 roller 33, an adjusting screw 34, a hand wheel 35, a No. 2 roller 36, and an electric cylinder 37. The positioning plate One end of 31 is hinged to the edge of the top side of lower die 2; the top surface of the positioning plate 31 is provided with a group of No. 1 positioning grooves 311, and the bottom surface of one end of the positioning plate 31 is hinged to one end of the adjusting plate 32; the adjusting plate 32 is L-shaped; The adjusting screw 34 is connected with the adjusting plate 32 by threads; one end of the adjusting screw 34 is fixedly connected with the handwheel 35, and the other end of the adjusting screw 34 is connected with the No. 1 roller 33 through a rotating shaft; Between 32, the No. 1 roller 33 is driven by the adjusting screw 34 to realize the adjustment of the angle between the positioning plate 31 and the adjusting...

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Abstract

The invention belongs to the technical field of semiconductor diode manufacturing. Specifically, it is a semiconductor diode production process. The process includes the following steps: putting the chips and leads of the semiconductor diode into a graphite boat, and sending the graphite boat into a welding furnace to make the semiconductor diode Connect the chip to the metal lead; put the welded semiconductor diode into the pickling machine for pickling; clean and dry the pickled semiconductor diode, and put it into the dispensing machine for dispensing and drying ; Put the glue-dispensed and dried semiconductor diode into the pin forming device for molding; perform surface treatment on the molded semiconductor diode, and then package the finished product after testing; the present invention realizes by hinged bending modules on both sides of the top of the lower mold. When the lower mold moves downward, the bending module swings around the hinge to bend the pin; a dust removal module is provided on the non-articulated side of the bending module to remove dust in the No. 1 positioning slot of the bending module.

Description

technical field [0001] The invention belongs to the technical field of semiconductor diode manufacturing, in particular to a semiconductor diode production process. Background technique [0002] Diode bending foot forming process is already a relatively mature process in the market, and there are also various automation equipment, which can solve the forming process of product diversification. But the disadvantages are also obvious. It is suitable for products with large quantities and few varieties, and it must be a braided product. There are also limitations on the thickness of the pins, and it cannot be popularized to all products. And the equipment cost is also high, it is impossible to standardize and automate the production of all products used. Usually, for small-batch products and repairs and supplements, most of them are carried out by manual bending. This method is difficult to guarantee dimensional accuracy, affects product quality, and is inefficient and labor-i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48
CPCB21F1/004B08B1/12
Inventor 陈欣洁王勇
Owner 吉林瑞能半导体有限公司
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