Printed circuit boards and communication equipment

A printed circuit board, board body technology, applied in the directions of printed circuits, printed circuits, printed circuit components, etc., can solve the problems of small wiring space, increased wiring density, and increased difficulty in optimizing links, and achieve compact structure. , to ensure the effect of wiring space

Active Publication Date: 2020-10-16
NEW H3C TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the number of ports is doubled, the wiring density is greatly increased, and the wiring space is small, which also increases the difficulty of optimizing the link.

Method used

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  • Printed circuit boards and communication equipment
  • Printed circuit boards and communication equipment
  • Printed circuit boards and communication equipment

Examples

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Embodiment Construction

[0029] In order to make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be described clearly and completely in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of the embodiments of the present invention, not all the embodiments. The components of the embodiments of the present invention generally described and illustrated in the drawings herein may be arranged and designed in various different configurations.

[0030] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ...

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PUM

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Abstract

The invention provides a printed circuit board and a communication device, and relates to the field of communication devices. The printed circuit board includes a board body. The board body includes afirst signal layer and a second signal layer, the board body is provided with a first signal hole group penetrating the first signal layer and a second signal hole group penetrating the second signallayer, the first signal layer is provided with the first reverse bonding pad area, the second signal layer is provided with a second reverse bonding pad area, and the projections of the first signalhole group and the second signal hole group on the board surface of the board body are located at the overlapping region of the projection of the first reverse bonding pad area on the board surface ofthe board body and the projection of the second reverse bonding pad area on the board surface of the board body. The printed circuit board and the communication device provided by the embodiments ofthe present invention are more compact in structure, thereby ensuring the sufficient wiring space.

Description

Technical field [0001] The invention relates to the field of communication equipment, and in particular to a printed circuit board and communication equipment. Background technique [0002] The port density of the current network switching equipment is getting higher and higher, and the switching capacity is getting larger and larger. In the current high-density switches, routers and other equipment, no matter the leap in speed or port density, PCB design is very difficult. challenge. Because the number of ports has doubled, the wiring density has greatly increased, and the wiring space is small, which also increases the difficulty of optimizing links. Summary of the invention [0003] One of the objectives of the present invention is to provide a printed circuit board, which can make the structure more compact and ensure sufficient wiring space. [0004] Another object of the present invention is to provide a communication device that can make the structure more compact and ensur...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K1/11
CPCH05K1/0213H05K1/112H05K2201/09427
Inventor 沈大勇张海涛
Owner NEW H3C TECH CO LTD
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