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Camera module and assembling method thereof

A camera module and lens assembly technology, which is applied in image communication, television, material gluing, etc., can solve the problems that the camera module cannot form clear image points and the image quality declines, so as to ensure the process yield, low cost, Effects that improve image quality

Pending Publication Date: 2018-09-28
KUNSHAN Q TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The warping of the image sensor chip will cause the imaging surface to deviate from the normal imaging surface, forming a curved imaging surface. The curved imaging surface, therefore, causes the camera module to fail to form clear image points, resulting in a decrease in imaging quality

Method used

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  • Camera module and assembling method thereof
  • Camera module and assembling method thereof
  • Camera module and assembling method thereof

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0038] see figure 1 , this embodiment provides a camera module 10 , the camera module 10 includes an image sensor chip 12 , a filter 14 , a lens assembly 17 and a light-transmitting sheet 15 . The optical filter 14 is arranged between the image sensor chip 12 and the lens assembly 17 , and the light-transmitting sheet 15 is arranged between the image sensor chip 12 and the lens assembly 17 .

[0039] During the imaging process of the camera module 10, the optical path around the light is greater than the optical path in the center, and a light-transmitting sheet 15 is arranged between the image sensor chip 12 and the filter 14, and the light-transmitting sheet 15 can make the light focus on the periphery. Relative to the central focal point, the light is imaged on the curved imaging surface, which compensates for the defect of the curvature of the imaging surface caused by the warping of the image sensor chip 12 .

[0040] In this embodiment, the light-transmitting sheet 15 o...

no. 2 example

[0047] see image 3 , this embodiment provides a camera module 10, the camera module 10 is a fixed-focus module. The camera module 10 includes a PCB board 11 , an image sensor chip 12 , a filter holder 13 , a filter 14 , a light-transmitting sheet 15 , a lens holder 16 and a lens assembly 17 . The lens assembly 17 , the transparent sheet 15 , the optical filter 14 and the image sensor chip 12 are arranged in sequence.

[0048] The PCB board 11 is arranged on the side of the image sensor chip 12 away from the filter 14 , the image sensor chip 12 is bonded on the surface of the PCB board 11 , and the image sensor chip 12 and the PCB board 11 are electrically connected by gold wires.

[0049] PCB board 11, also known as printed circuit board, has an upper surface and an opposite lower surface, and is a provider of electrical connections for electronic components. Rigid PCB boards, flexible PCB boards, and rigid-flex boards can be used. Combine board. The image sensor chip 12 m...

no. 3 example

[0057] see Figure 4 , this embodiment provides a camera module 10, the camera module 10 is an auto-focus module. The camera module 10 includes a PCB board 11 , an image sensor chip 12 , a filter holder 13 , a filter 14 , a light-transmitting film 15 , a motor 18 and a lens assembly 17 . The lens assembly 17 , the transparent sheet 15 , the optical filter 14 and the image sensor chip 12 are arranged in sequence.

[0058] The PCB board 11 is arranged on the side of the image sensor chip 12 away from the filter 14 , the image sensor chip 12 is bonded on the surface of the PCB board 11 , and the image sensor chip 12 and the PCB board 11 are connected by gold wires.

[0059] The filter holder 13 is arranged between the PCB board 11 and the lens assembly 17, and the PCB board 11 and the filter holder 13 are bonded. The optical filter 14 is installed on the optical filter holder 13 , so that the optical filter 14 is arranged parallel to the image sensor chip 12 at intervals.

[0...

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Abstract

The invention provides a camera module and an assembling method thereof, and relates to the field of the camera module. The camera module comprises an image sensor chip, an optical filer, a lens component and an optical transmitter; the optical filter is arranged between the image sensor chip and the lens component; the optical transmitter is arranged between the image sensor chip and the lens component and used for enabling to the light to image on a bent imaging surface formed by the warping of the image sensor chip. The camera module can fill a defect that the warping of the image sensor chip causes the bending of the imaging surface, so that the light can be imaged on the bent imaging surface, and the image quality is improved.

Description

technical field [0001] The present invention relates to the field of camera modules, in particular to a camera module and an assembly method thereof. Background technique [0002] At present, during the preparation process of the camera module, when the image sensor chip is bonded to the PCB board, because the glue on the PCB board is not completely evenly coated between the PCB board and the image sensor chip, generally there will be images. There is no glue on the part of the sensor chip in contact with the PCB board. Commonly, there is no glue on the edges of the image sensor chip or at the four endpoints of the image sensor chip. Therefore, during the molding process, the upper and lower During molding and pressing, part of the image sensor chip will warp due to lack of colloidal support. In addition, the surface of the PCB board itself may be uneven. After the image sensor chip is bonded to the surface of the PCB board, the image sensor chip will naturally warp along w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/225F16B11/00
CPCF16B11/006H04N23/50H04N23/55H04N23/54
Inventor 李海龙
Owner KUNSHAN Q TECH CO LTD
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