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electronic components

A technology of electronic components and recesses, applied to electrical components, parts of transformers/inductors, circuits, etc., can solve problems such as insufficient chip volume

Active Publication Date: 2020-10-09
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, sometimes the capacity of the chip cannot be sufficiently secured

Method used

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Embodiment Construction

[0017] Embodiments will be described in detail below with reference to the drawings. In the description, the same symbols are used for the same elements or elements having the same functions, and overlapping descriptions are omitted.

[0018] refer to Figure 1 ~ Figure 3 The laminated coil component of the embodiment will be described. figure 1 It is a perspective view of the laminated coil component of embodiment. figure 2 yes figure 1 An exploded perspective view of the laminated coil assembly shown. image 3 yes means figure 1 A top view of the relationship between the coil and mounting conductor shown. image 3 It is a plan view of the laminated coil component 1 viewed from the side surface 2e, and the element body 2 and the connection conductors 6 and 7 are indicated by dotted lines.

[0019] Such as Figure 1 ~ Figure 3 As shown, the laminated coil component 1 of the embodiment includes an element body 2 , mounting conductors 3 , 4 , a plurality of coil conducto...

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Abstract

The present invention relates to an electronic component including: an element body provided with a first concave portion; and a mounting conductor having a first conductor portion arranged in the first concave portion. The first conductor portion has a first surface opposing the bottom surface of the first recess, a second surface opposing the first surface, and a third surface connecting the first surface and the second surface. Viewed from the opposing direction between the bottom surface of the first concave portion and the first surface, the third surface has a region overlapping with the second surface.

Description

technical field [0001] One aspect of the present invention relates to an electronic component. Background technique [0002] There is known an electronic component including a chip and a mounting conductor provided on the surface of the chip. In this electronic component, since the mounting conductors are formed on the outer surface of the chip, it is necessary to make the size of the chip slightly smaller than the predetermined size of the electronic component. Therefore, the capacity of the chip may not be sufficiently ensured. Therefore, Japanese Patent No. 4816971 discloses an electronic component including an element body and a mounting conductor arranged in a recess provided on the element body. In this electronic component, since the conductor for mounting is arranged in the concave portion, the volume of the element body can be ensured. Contents of the invention [0003] In the above-mentioned electronic components, cracks may occur in the element body. [0004...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F17/04
CPCH01F17/04H01F2017/0066H01F17/0013H01F27/292H01F41/04H01F27/323H01F27/28
Inventor 石间雄也松山靖志贺悠人青木俊二近藤真一
Owner TDK CORPARATION
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