High-temperature-resistant catching and releasing machine for semiconductor plastic package product

Abstract

The invention aims to provide a high-temperature-resistant catching and releasing machine for a semiconductor plastic package product, which is simple in structure, convenient and quick to operate andhigh in working efficiency. The high-temperature-resistant catching and releasing machine comprises a fixed plate, a moving plate and a moving block, wherein identical waist-shaped holes are correspondingly formed in the moving plate and the moving block; the moving plate and the moving block are fixed by bolts; tension springs and roller bearings are respectively arranged between the moving plate and the moving block; positions of the tension springs and a first shank are located on one horizontal line; mounting blocks are fixedly connected among the fixed plate, the moving block and the moving plate; a second shank is fixed on the fixed plate through shank mounting blocks, and limiting blocks L are arranged on the mounting blocks; the first shank is fixed on the moving plate through clamping blocks; a plurality of limiting blocks R are symmetrically and uniformly distributed on the moving plate along lengthwise directions of the waist-shaped holes; a plurality of locking blocks aresymmetrically and uniformly distributed on the fixed plate; a plurality of second supporting claws are symmetrically and uniformly distributed on the waist-shaped holes along the lengthwise directionof the moving plate; and a plurality of first supporting claws are symmetrically and uniformly distributed on the waist-shaped holes along a width direction of the moving plate.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a high temperature resistant pick and place machine for semiconductor plastic packaging products. Background technique [0002] In the traditional semiconductor plastic packaging equipment, the product packaging process requires manual manual removal of the preheated lead frame from the chip layout machine and put it into the mold to be plastic-encapsulated. After the product is packaged, the product in the mold is manually removed. Since the lead frame temperature is as high as 175°C, it has a significant impact on the personal safety of the operator. At the same time, it is required that the lead frame should not be deflected in the mold, otherwise it will affect the quality of the packaged products. SUMMARY OF THE INVENTION [0003] The purpose of the present invention is to provide a high temperature resistant pick and place machine for semiconductor plastic packaging products...

AI Technical Summary

Problems solved by technology

Since the temperature of the lead frame is as high as 175°C, it will have a significant impact on the personal safety of the operator. At the same time, it is required that the lead frame should not be tilted when placed in the mold, otherwise the quality of the packaged product will be affected.

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