Surface roughening treatment method of smooth-contour copper foil

Abstract

The invention discloses a surface roughening treatment method of smooth-contour copper foil. As for the surface roughening treatment method, the rough face of the copper foil is roughened, a copper sulfate electrolyte is used, and homogeneous vulcanization crystallization is formed on the rough face of the copper foil being subjected to hydrogen peroxide-sulfuric acid micro-etching liquid treatment; the smooth face topography of the copper foil being subjected to hydrogen peroxide-sulfuric acid micro-etching liquid treatment is not affected; and the concentration of hydrogen peroxide-sulfuricacid micro-etching liquid is 10-50 g / L. According to the surface roughening treatment method of the smooth-contour copper foil, in the roughening step of the surface treatment work procedure of the smooth-contour copper foil, the rough face of the copper foil is subjected to roughening treatment independently, so that homogeneous vulcanization crystallization is formed on the rough face of the copper foil, the smooth face topography of the copper foil is not affected, and the processing requirement in the PCB manufacturing process of the smooth-contour copper foil is met.

Description

technical field [0001] The present invention relates to a method for roughening the surface of smooth contour copper foil, in particular to a method for roughening the surface of smooth contour copper foil, the copper foil for high-speed high-frequency circuits obtained by the method, and the smooth contour copper foil used by the method Surface roughening treatment device, copper foil for high-speed and high-frequency circuits obtained by the device, copper-clad laminates produced by using the copper foil for high-speed and high-frequency circuits obtained by the method and / or the device, and copper-clad laminates using the copper-clad laminates produced printed circuit boards. Background technique [0002] In recent years, with the rapid development of electronic products and mobile communications, the research and application of printed circuit boards (PCB) have also become mature and refined. In the PCB industry, copper foil with smooth contours will be It is widely use...

AI Technical Summary

Problems solved by technology

However, the amount of micro-etching on the matte surface of the existing roughened copper foil is insufficient, and the roughness of the nodular grains is insufficient and uneven, which will cause the circuit to float easily when the copper foil is pressed into the substrate and etched to make the circuit, and the resistance The peel strength is poor, which cannot meet the requirements of high-frequency and high-speed circuit production, which affects the production quality of printed circuit boards

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