An MEMS piezoelectric sensor and a manufacturing method thereof

Abstract

An MEMS piezoelectric sensor and a manufacturing method thereof are provided. A first substrate includes a first base, at least one electrically conductive layer at one side of the first base, a signal processing circuit and / or a driving circuit. The signal processing circuit and / or the driving circuit are electrically connected to the electrically conductive layer. A second substrate includes a second base, a first electrode on one side of the second base and a piezoelectric medium layer at one side of the first electrode. The side, of the first substrate, provided with the electrically conductive layer is adhered and fixed to the side, of the second substrate, provided with the first electrode and the piezoelectric medium layer, and after the first electrode and the electrically conductive layer are electrically connected with electrically conductive holes, electrical signals output by the first electrode after deformation can be received by the signal processing circuit, and / or electrical signals are input to the first electrode through the driving circuit to allow the first electrode and the piezoelectric medium layer to be deformed. Accordingly, properties of the MEMS piezoelectric sensor can be improved, process difficulty is reduced and ranges of materials and processes are wider.

Description

[0001] This application claims the priority of the Chinese patent application with the application number 201710044935.3 and the title of the invention "a MEMS piezoelectric sensor and its manufacturing method" submitted to the China Patent Office on January 20, 2017, the entire contents of which are incorporated by reference in In this application. technical field [0002] The invention relates to the technical field of semiconductor manufacturing, and more specifically, relates to a MEMS piezoelectric sensor and a manufacturing method thereof. Background technique [0003] Piezoelectric sensors refer to sensors made using the piezoelectric effect of certain dielectrics. Wherein, the piezoelectric effect includes a direct piezoelectric effect and an inverse piezoelectric effect. A piezoelectric sensor utilizing the positive piezoelectric effect, such as a pressure sensor, will output an electrical signal when subjected to an external force, and the pressure information can...

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Problems solved by technology

[0004] In the prior art, the piezoelectric sensor and the signal processing circuit (or driving circuit) are mostly manufactured on different substrates, and then the two are connected together by common packaging or circuit board assembly. However, the packaging process More complex, larger in size and higher in cost

[0005] Although it is also disclosed in the prior art that the piezoelectric sensor and the signal processing circuit (or driving circuit) can be fabricated on the same substrate, when the piezoelectric sensor and the signal processing circuit (or driving circuit) are fabricated on the same substrate , because the manufacturing process of the piezoelectric sensor and the signal processing circuit (or driving circuit) is quite different, therefore, the manufacturing process of the piezoelectric sensor will affect the performance of the signal processing circuit (or driving circuit), and the signal processing circuit (or driving circuit) The manufacturing process will also affect the performance of the piezoelectric sensor, so that the performance of the MEMS piezoelectric sensor fabricated on the same substrate is poor

[0006] Moreover, the existing MEMS piezoelectric sensors can only utilize the positive piezoelectric effect or the inverse piezoelectric effect, and there is no disclosure of a MEMS pressure sensor that can simultaneously utilize the positive piezoelectric effect and the inverse piezoelectric effect. Based on this, how to integrate the piezoelectric sensor , signal processing circuits and drive circuits have also become one of the current research directions

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