Electronic product manufacturing equipment

Abstract

The invention belongs to the technical field of production of electronic products, and specifically relates to electronic product manufacturing equipment. The equipment includes a rack and a support table used for supporting a wafer, and also includes an ejection mechanism, a hydraulic cylinder, a hydraulic piston and a push-and-pull part used for enabling the hydraulic piston to move in the hydraulic cylinder in a reciprocating manner, wherein the hydraulic cylinder is connected to the rack; a plurality of ejection holes are arranged in the support table; the ejection mechanism includes at least two ejection units, and each ejection unit includes an ejection rod, an ejection piston, a piston rod and a piston cylinder; the cross section of each ejection rod is different, the ejection rod of a relatively small cross section area is slidably connected in the ejection rod of a relatively large cross section area, the ejection of the relatively large cross section area can drive the ejection rod of the relatively small cross section area to penetrate through the ejection holes together, and end parts of all the ejection rods, which are used for ejecting chips, are flush. According to the scheme, during ejection of the chips, ejection rods of different sizes can be used aiming at chips of different sizes, a process of manual replacement of the ejection rods is avoided, and production efficiency is improved.

Description

technical field [0001] The invention belongs to the technical field of electronic product production, and in particular relates to electronic product manufacturing equipment. Background technique [0002] Electronic products refer to electronic products used in daily consumer life. Chips, also known as microcircuits, microchips, and integrated circuits, refer to silicon chips containing integrated circuits. They are small in size and are the most important part of electronic products, undertaking the functions of computing and storage. The complete process of chip production includes several links such as chip design, wafer production, packaging production, and cost testing; the raw material for its production is wafers. Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer; it can be processed into various circuit element structures on the silicon wafer, and become an IC wi...

AI Technical Summary

Problems solved by technology

[0004] At present, manufacturers often need to produce chips of different sizes and specifications, but at present when using ejector pins to jack up chips, the following defects often occur: 1. When using smaller-sized ejector pins to jack up larger-sized chips At this time, because the local stress area of ​​the chip is concentrated in the position where the chip is in contact with the ejector pin, the force on the chip is uneven, and the chip itself is very thin, so it is easy to cause problems such as chip breakage; 2. When using a larger size pusher When the ejector pin jacks up a small-sized chip, it is easy to lift up the chip next to it because the ejector pin is too large, resulting in the inability to accurately pick up the chip at the target position; and in order to avoid this problem, some factories use It is to manually replace the ejector pin to fit the size of the chip, but this method is too troublesome and reduces production efficiency

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