Intelligent power module aluminum base plate and plate dividing method thereof, positioning device and air conditioner

Abstract

The invention discloses an intelligent power module aluminum base plate and a plate dividing method thereof, a positioning device and an air conditioner. The plate dividing method comprises: a plurality of parallel X-axis cutting lines are arranged along an X axis direction and a plurality of parallel Y-axis cutting lines are arranged along a Y axis direction on a pre-made large aluminum substrate, and through holes with preset inner through hole diameters are drilled at intersection points of all X-axis cutting lines and all Y-axis cutting lines; according to a preset V_cut cutting rule, V_cut processing is carried out on the large aluminum substrate along each X-axis cutting line and each Y-axis cutting line, so that the large aluminum substrate is cut into a plurality of predetermined-sized intelligent power module aluminum substrates with a quarter of through holes formed in four corners, wherein all quarter through holes are used as printing positioning holes of the intelligent power module aluminum substrates. Therefore, the production efficiency of the intelligent power module is increased and the service life of the intelligent power module is prolonged.

Description

technical field [0001] The invention relates to the field of manufacturing, in particular to an aluminum substrate of an intelligent power module, a method for separating the panels, a positioning device and an air conditioner. Background technique [0002] Intelligent Power Module, or IPM (Intelligent Power Module), is a power drive product that combines power electronics and integrated circuit technology. The intelligent power module integrates the power switching device and the high-voltage driving circuit, and has built-in fault detection circuits such as overvoltage, overcurrent and overheating. For specific-purpose intelligent power modules, an MCU will also be integrated, and the MCU will send out control signals to make the power components of the intelligent power module drive subsequent circuits to work, and on the other hand, send the system status detection signal back to the MCU. Compared with traditional discrete solutions, intelligent power modules have won a...

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Problems solved by technology

[0003] However, traditional splitting methods for aluminum substrates of intelligent power modules usually use stamping splitting method, V_cut cutting splitting method or screw splitting method, but these three splitting methods have corresponding advantages and disadvantages

Specifically, the advantage of the screw board splitting method is that the size of the split boards is consistent; the defect of the screw board splitting method is that the production efficiency is low, the consumption of consumables is large, it can only be used for experiments, and it is difficult to achieve mass production

The stamping sub-board method is generally suitable for sub-boarding of larger aluminum substrates. Its advantage is that the size of the sub-boards is consistent, and the peripheral dimensions of the available aluminum substrates can play a role in positioning in the subsequent smart power module packaging, thereby realizing pins, wafers, etc. And the one-time welding of electronic components simplifies the processing of intelligent power modules and improves production efficiency; the defect of stamping and sub-board method is that there is a risk of damage to the insulating layer in the middle of the aluminum substrate, and the damage of the insulating layer will affect the intelligent power module. The reliability of the module for long-term use

The advantage of the V_cut cutting board method is that there is no risk of damaging the insulating layer in the middle of the aluminum substrate; the disadvantage of the V_cut board method is that the board is prone to burrs, and the peripheral size of the aluminum substrate is difficult to be packaged in the subsequent smart power module. It plays a positioning role in the center, which increases the processing complexity of the smart power module, resulting in low production efficiency of the smart power module

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