Modeling method of oplc thermal circuit model based on superposition principle
A technology of thermal circuit model and modeling method, which is applied in special data processing applications, design optimization/simulation, calculation, etc., and can solve the problems of low model parameter accuracy and large temperature error.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0066] The invention proposes an OPLC thermal circuit model modeling method based on the superposition principle. Through the simulation of the OPLC temperature field, it can be known that the heating of the OPLC four-cable core is asymmetrical, so the invention models the thermal circuit model under the condition of four-cable core heating and the thermal circuit model under the condition of single-core heating, and applies the principle of superposition to The thermal circuit models in the two cases are superimposed, and then the thermal circuit model in the case of three-core heating is obtained. In order to improve the accuracy of the model, the particle swarm optimization algorithm was used to identify the parameters in the model, and the optimization of the model parameters was realized through the simulation of the MATLAB platform, which improved the accuracy of the model parameters, and then obtained more accurate temperature values of each layer of OPLC, which was ve...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com