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Novel hot melting equipment

A hot-melting and equipment technology, applied in the field of new hot-melting equipment, can solve the problems of increasing production costs, failing to achieve expected fixation, riveting points falling off, and achieving the effect of reducing production costs and avoiding cracks

Pending Publication Date: 2018-06-12
东莞市托圣斯电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the high requirements of ultrasonic welding on the design of the structure and the characteristics of the material, and the fact that the hot-melt head has no preload before hot-melting and no cooling time after hot riveting, cracks appear during the bonding process of the two plastics, and the riveting points fall off, thus Can not achieve the expected fixed effect, and will increase production costs

Method used

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  • Novel hot melting equipment

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Embodiment Construction

[0014] The technical solutions in the embodiments of the present invention are clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0015] In the following description, a lot of specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here, and those skilled in the art can do it without departing from the meaning of the present invention. By analogy, the present invention is therefore not limited to the specific examples disclosed below.

[0016] The present inve...

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Abstract

The invention discloses novel hot melting equipment. The novel hot melting equipment is mainly used in the technical field of plastic hot melting of electronic products. The novel hot melting equipment comprises a work frame. The work frame comprises a bottom plate, a top plate and a first fixing plate and further comprises a first driving unit, a second driving unit and a product fixing jig whichare arranged on the work frame. The first driving unit is fixed to the first fixing plate. The second driving unit is fixedly connected to the top plate. The product fixing jig is fixedly connected to the bottom plate. The mounting positions of the first driving unit and the second driving unit are matched with the position of the product fixing jig. According to the novel hot melting equipment,by the adoption of the technical scheme, the no pre-pressure and no-cooling time problems of existing hot melting equipment can be solved, the production cost can be lowered, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of plastic hot-melt for electronic products, in particular to a novel hot-melt equipment. Background technique [0002] In the electronic product industry, ultrasonic welding or ultrasonic + hot-melt head high-temperature welding is mostly used in the joining process of two kinds of plastic parts to achieve the fixing effect. This method has been widely used. However, due to the high requirements of ultrasonic welding on the design of the structure and the characteristics of the material, and the fact that the hot-melt head has no pre-pressure before hot-melting and no cooling time after hot riveting, cracks appear during the bonding process of the two plastics, and the riveting points fall off. The expected fixed effect cannot be achieved, and the production cost will be increased. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a new type of h...

Claims

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Application Information

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IPC IPC(8): B29C65/42
CPCB29C65/42B29C66/81B29C66/8242
Inventor 蔡庆功周俊招
Owner 东莞市托圣斯电子科技有限公司
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