Backlight FPC board and backlight half-finished product

Abstract

The invention discloses a backlight FPC board which includes an FPC board and multiple groups of pads arranged in an array along the length direction of the FPC board. The pads are bonded together through a jump wiring process. Each group of pads includes a pole A and a pole K. The jump wiring process is that the K pole of each pad jumps across an adjacent pad and is connected with the pole A of the next pad through a printed line. The invention further presents a backlight half-finished product which includes a light guide plate, an LED component and a backlight FPC board. The backlight FPC board is connected horizontally to the lower end of the light guide plate. The LED component is adhered to the back of the backlight FPC board through SMT. Solder paste is applied between the LED component and the backlight FPC board. The technical scheme can avoid the flash of backlight caused by the elevation of the LED component due to the fact that the lines absorb the solder paste. The loss ofbacklight brightness is reduced because of the high co-linearity, low line resistance and low current loss of LEDs. The thickness of the FPC board can be effectively controlled. The light effect andoptical brightness of the product can reach the best state.

Description

technical field [0001] The invention relates to the technical field of backlight products and semi-finished products, in particular to a backlight FPC board and a backlight semi-finished product. Background technique [0002] With the development of science and technology, liquid crystal displays have been widely used in various electronic devices that need to be displayed. Since the liquid crystal material itself does not have self-luminous special effects, it is necessary to use a special backlight module to provide the liquid crystal display panel with light for displaying images. Backlight. The backlight module usually includes a light source, such as a light guide plate, which is used to scatter the light emitted by the light source to provide uniform surface-emitted light. [0003] refer to figure 1 , which is a schematic diagram of the solder pads and wiring structure on the FPC board of the backlight in the prior art, and the electrical connection lines 3 between t...

AI Technical Summary

Problems solved by technology

This makes the circuit need to be between adjacent pads, so that the FPC light bar is likely to be easily stacked due to excessive solder paste during the SMT placement process, which may easily cause the LED to be raised and the backlight to have a lamp eye problem, and the LED collinearity is poor. The problem

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