Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Semi-conductor ultrasonic washing machine

An ultrasonic and semiconductor technology, applied in the field of semiconductor ultrasonic cleaning machines, can solve the problems of low degree of automation, inability to dry, and low cleaning efficiency, and achieve high cleaning efficiency, increase drying rate, and good cleaning effect.

Inactive Publication Date: 2018-04-27
HUAIAN SHENGYU ELECTRONICS
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a semiconductor ultrasonic cleaning machine, to solve the problems that the current semiconductor ultrasonic cleaning machine proposed in the above-mentioned background technology has low cleaning efficiency, low degree of automation and inability to dry

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semi-conductor ultrasonic washing machine

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0014] The present invention provides figure 1 The semiconductor ultrasonic cleaning machine shown includes a supporting base 1, a first L-shaped steel frame 2, a metal fixed buckle 3, a carrier 4, an infrared searchlight 5, a nozzle 6, an electric telescopic rod 7, and a second L-shaped Steel frame 8, infusion hose 9, liquid tank 10, suction pump 11, battery 12, timing controller 13, ultrasonic vibration plate 14, frequency controller 1...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a semiconductor ultrasonic cleaning machine, which comprises a support base, a metal fixing buckle, a loading vessel, an infrared searchlight, a spray head, an electric telescopic rod, a liquid tank, a liquid suction pump, a storage battery, an ultrasonic vibration plate, a hinge shaft and a roller , the right end of the support base is fixedly connected to the lower end of the first L-shaped steel frame; an ultrasonic vibration plate is fixed above the support base; metal fixing buckles are fixed around the turntable; the second L-shaped steel frame One end of the horizontal bracket is fixed with an electric telescopic rod; the end of the telescopic rod of the electric telescopic rod is fixedly connected with the nozzle; the liquid tank is provided with a suction pump; the liquid suction port of the liquid suction pump passes through the infusion hose It is fixedly connected with the nozzle; the inner left end of the support base is fixed with a storage battery; and the surrounding of the support base is fixed with rollers. The invention has the beneficial effects of high cleaning efficiency, high degree of automation, high drying efficiency and convenient mobile use.

Description

Technical field [0001] The invention belongs to the technical field of semiconductor equipment, and specifically relates to a semiconductor ultrasonic cleaning machine. Background technique [0002] The semiconductor ultrasonic cleaning machine uses ultrasonic cavitation, acceleration and direct flow in the liquid to directly and indirectly affect the liquid and dirt, so that the dirt layer is dispersed, emulsified, and peeled to achieve the purpose of cleaning. Among the methods, the ultrasonic cleaning efficiency is the highest and the best effect. The current semiconductor ultrasonic cleaning machine has low cleaning efficiency, low automation and inability to dry. [0003] Therefore, it is very necessary to invent a semiconductor ultrasonic cleaning machine. Summary of the invention [0004] The purpose of the present invention is to provide a semiconductor ultrasonic cleaning machine to solve the problems of low cleaning efficiency, low automation and inability to dry the curr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B08B3/12B08B13/00F26B3/30
CPCB08B3/12B08B13/00B08B2209/005F26B3/30
Inventor 宗启军
Owner HUAIAN SHENGYU ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com