Diamond wire silicon wafer cutting process

Abstract

The invention discloses a diamond wire cutting technology which is used for silicon wafers and can realize wire cutting of silicon rods, improve the cutting efficiency and reduce the cutting cost. Thetechnology comprises steps as follows: (1) resin plates are bonded to the upper surfaces of the silicon rods by the aid of a silicon rod feeding device; (2) after the resin plates are bonded to the silicon rods, the silicon rods are fixed on a silicon rod wire-cutting machine, and cutting metal wires adopt diamond wires; (3) then the silicon rods are cut, in the cutting process, the feeding speedranges from 0.12 mm / min to 0.32 mm / min, the linear speed of the diamond wires ranges from 640 m / min to 700 m / min, the laying tension is 21 N, the take-up tension is 20 N, the cutting temperature is 23 DEG C, and the flow of a cutting fluid is 35 HZ. With adoption of the technology, automatic cutting can be realized favorably, the cutting efficiency can be improved, and the cutting cost can be reduced.

Description

technical field [0001] The invention relates to the field of diamond wire cutting of silicon wafers, in particular to a diamond wire silicon wafer cutting process. Background technique [0002] We all know that silicon wafers are the main raw material for solar cell production and even in the field of photovoltaics. The quality of silicon wafer cutting process directly affects the conversion efficiency of solar cells. The photovoltaic market is constantly developing, and the silicon wafer cutting process is also constantly improving. From the traditional saw blade and grinding wheel cutting technology at the beginning, it has developed into wire cutting technology. A high-speed moving steel wire drives the cutting blade attached to the steel wire to rub against the silicon rod to achieve the cutting effect. However, this traditional wire cutting needs to be effectively cut under the action of cutting fluid and silicon carbide. This cutting process takes a long time to cu...

AI Technical Summary

Problems solved by technology

However, this traditional wire cutting needs to be effectively cut under the action of cutting fluid and silicon carbide.

This cutting process takes a long time to cut, and also produces waste mortar and waste cutting fluid, and the cost of silicon wafer cutting is relatively high.

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