Quartz wafer grinding-cleaning machine and grinding-cleaning process thereof

Abstract

The invention discloses a quartz wafer grinding-cleaning machine and a grinding-cleaning process thereof, and is applied to the technical field of quartz wafer cleaning. According to the quartz wafergrinding-cleaning machine and the grinding-cleaning process thereof, the structure is simple, operation is convenient and fast, and the working efficiency is high. The quartz wafer grinding-cleaning machine comprises a rack, a first cleaning tank, a second cleaning tank and a third cleaning tank, and the first cleaning tank, the second cleaning tank and the third cleaning tank are sequentially arranged on the rack and internally provided with cradle frames; a wafer fixing device is mounted on each cradle frame in a matched mode, the rack is provided with three motors, and the three motors arecorrespondingly connected with the cradle frames in the first cleaning tank, the second cleaning tank and the third cleaning tank; and circulating pipes are arranged between the first cleaning tank and the second cleaning tank as well as the second cleaning tank and the third cleaning tank, the upper end of the third cleaning tank is provided with a water injection pipeline, and the side end of the first cleaning tank is provided with a draining pipeline.

Description

technical field [0001] The invention relates to a quartz wafer grinding and cleaning machine and a grinding and cleaning process thereof. Background technique [0002] One of the processes of quartz wafer processing is to grind the wafers to the frequency range required by customers through grinding sand. After the processing is completed, these ground wafers need to be cleaned. The cleanliness of wafer cleaning determines the accuracy of the angle sorting process. The residual sand left on the wafer during the grinding process will affect the accuracy of the wafer angle measurement, especially in some orders with high precision requirements from customers. Wafers with residual sand on the surface are likely to cause errors during angle sorting. Judgment, when it is finally processed into a quartz oscillator, it will exceed the specified frequency PPM range within the required temperature range. When the wafer is processed to high frequency, the thickness is only 0.03-0.1mm...

AI Technical Summary

Problems solved by technology

When the wafer is processed to high frequency, the thickness is only 0.03-0.1mm, and the wafers are easy to stick together. The traditional cleaning method is difficult to separate the wafer and thoroughly clean the sand in the middle, resulting in abrasive sand remaining on the wafer surface

Images