Chip heat dissipation structure in voice recognition device

Abstract

The invention discloses a chip heat dissipation structure in a voice recognition device. The chip heat dissipation structure comprises a shell, the upper surface of the outer wall of the shell is fixedly connected with a first fixing rod, and the top end of the first fixing rod is fixedly connected with the lower surface of a first driving device. The first driving device is meshed with a gear rod, and the bottom end of the gear rod is fixedly connected with the top end of a slide bar, a sliding sleeve is connected to the outer wall of the slide bar in a sleeved mode, the sliding sleeve is clamped on the upper surface of the outer wall of the shell, the bottom end of the sliding rod is fixedly connected with a first movable plate, and a first sliding block is fixedly connected to the leftside surface and the right side surface of the first movable plate. The chip heat dissipation structure in the voice recognition device is characterized in that a second motor, a third motor, a turntable, a pin shaft, a traction rope, a second movable plate, a spring and a telescopic rod work jointly, so that the heat dissipation of the chip body is realized, the situation that a chip body is damaged due to heating is avoided, and the service life of the chip body is guaranteed.

Description

technical field [0001] The invention relates to the field of electric power technology, in particular to a chip heat dissipation structure in a speech recognition device. Background technique [0002] A chip is an integrated circuit, which generally refers to all electronic components. It is a circuit module that integrates various electronic components on a silicon board to achieve a specific function. It is the most important part of electronic equipment, undertaking the functions of computing and storage. The application range of integrated circuits covers almost all electronic equipment for military and civilian use. [0003] The chip will generate heat when it is working. If the heat cannot be dissipated in time, it will definitely affect its normal operation, resulting in a decrease in speed and even affecting its service life, thereby affecting the operation of power equipment and bringing losses to people. inconvenience to life. Contents of the invention [0004...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a chip heat dissipation structure in a speech recognition device, which solves the problem that the chip will generate heat during operation. If the heat cannot be dissipated in time, it will definitely affect its normal operation, resulting in speed Reduce or even affect its service life, thus affecting the operation of power equipment, bringing losses to people, and bringing inconvenience to people's lives

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