Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Automatic heat radiation testing method for memory and system thereof

A test method and memory technology, applied in the direction of applying stable tension/pressure to test the strength of materials, measuring devices, measuring heat, etc., can solve the problems of easy deviation, large consumption of heat dissipation test, inaccurate test results, etc., to reduce Manpower requirements, energy savings, and inaccuracy reduction effects

Inactive Publication Date: 2018-03-23
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
View PDF5 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide an automatic heat dissipation test method and system for memory, which is used to solve the problems that the heat dissipation test of memory consumes a lot of manpower and material resources, the test results are inaccurate, and deviations are prone to occur

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Automatic heat radiation testing method for memory and system thereof
  • Automatic heat radiation testing method for memory and system thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] In order to clearly illustrate the technical features of the present solution, the present invention will be described in detail below through specific implementation methods and in conjunction with the accompanying drawings. The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. To simplify the disclosure of the present invention, components and arrangements of specific examples are described below. Furthermore, the present invention may repeat reference numerals and / or letters in different instances. This repetition is for the purpose of simplicity and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. It should be noted that components illustrated in the figures are not necessarily drawn to scale. Descriptions of well-known components and processing techniques and processes are omitted herein to avoid unnecessarily lim...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An automatic heat radiation testing method for a memory comprises the following steps of adjusting a testing environment; loading a testing pressure; detecting whether the pressure is maximized, if not, performing pressurizing continuously, and otherwise, performing a next step; and unloading the pressure. The invention further provides an automatic heat radiation testing system for the memory. Inthe heat radiation testing process of the memory, inaccurate testing result caused by change of factors such as man-caused air current and ambient temperature is greatly reduced, and operation reliability of a server is improved. The automatic heat radiating testing method and the system thereof further have advantages of reducing requirement for manpower, improving equipment utilization rate, greatly improving working efficiency and saving energy consumption.

Description

technical field [0001] The invention relates to the technical field of memory testing, in particular to a method and system for automatic heat dissipation testing of memory. Background technique [0002] The composition of the server includes processors, memory, hard disks, motherboards, etc., because they are formulated for specific applications, so servers and microcomputers have different aspects in terms of processing power, stability, manageability, scalability, reliability, security, etc. There are big differences. Especially with the advancement of information technology, people have higher and higher requirements for servers, especially for data storage and computing capabilities. Memory is one of the important components in a computer, and it is a bridge to communicate with the CPU. All programs in the computer run in the memory, so the performance of the memory has a great impact on the computer. Memory (Memory), also known as internal memory, is used to temporar...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G01L5/00G01N3/12G01K13/00G01K1/02
CPCG01K1/024G01K13/00G01L5/00G01N3/12
Inventor 李成路
Owner ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com