A power module ceramic liner

Abstract

The invention discloses a power module ceramic liner, which comprises: a first metal layer, a second metal layer and a third metal layer arranged sequentially from top to bottom. A first ceramic layer is arranged between the first metal layer and the second metal layer, and a second ceramic layer is arranged between the second metal layer and the third metal layer. The first metal layer is set as the emitter area and the control signal terminal area isolated from each other, and the second metal layer is set as the collector area. The second metal layer may further extend to the upper surface of the first ceramic layer through through holes arranged in the first ceramic layer. Grooves for mounting the first power chip and the second power chip are formed on the upper surface of the substrate along the thickness direction, and the grooves extend from the first metal layer to the second metal layer. The present invention can solve the problem that the stray inductance of the circuit interconnection structure of the ceramic liner of the existing power module is large, welding tools are required for chip welding, the metal layer on the front side of the liner is a combination layer of strong electricity and weak electricity, and the interconnection between the liners is relatively complicated. question.

Description

technical field [0001] The invention relates to the field of manufacturing power semiconductor devices, in particular to a power module ceramic liner structure. Background technique [0002] The substrate 10 is a basic unit structure of a power semiconductor module (such as an IGBT module), and plays multiple functions such as electrical interconnection, electrical insulation, and heat dissipation channels. The vertical structure of the traditional IGBT module liner is as attached figure 1 As shown, the ceramic liner adopts a three-layer structure, that is, one ceramic layer (ceramic layer 12) and two metal layers (front metal layer 11 and back metal layer 13), and the metal layer is isolated by the ceramic layer. The role of the ceramic layer is to insulate, prevent high voltage breakdown, and also play a role in heat dissipation. The function of the front metal layer is to realize circuit interconnection. Usually, the second power chip and the first power chip are placed...

AI Technical Summary

Problems solved by technology

[0005] In view of this, the object of the present invention is to provide a power module ceramic liner to solve the problem that the existing power module ceramic liner circuit interconnection structure has large stray inductance, chip welding needs to use welding tools, and the metal layer on the front side of the liner is strong. The combination layer of electricity and weak electricity, and the technical problems of interconnection between lining boards are relatively complicated

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