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Target material, forming method of target material, target material assembly and forming method of target material assembly

A target and component technology, which is applied in the field of target components and its formation, and the target and its formation, can solve the problems of increasing the thickness of the target and poor uniformity of sputtering film formation, so as to improve the uniformity, increase the life, The effect of improving uniformity

Inactive Publication Date: 2018-02-13
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

However, the existing designs simply increase the thickness of the target
Although increasing the thickness of the target can prolong the life of the target, but in the later stage of sputtering with the target, the uniformity of sputtering film formation is poor

Method used

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  • Target material, forming method of target material, target material assembly and forming method of target material assembly
  • Target material, forming method of target material, target material assembly and forming method of target material assembly
  • Target material, forming method of target material, target material assembly and forming method of target material assembly

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Embodiment Construction

[0029] As mentioned in the background art, it is necessary to propose a more optimized design of the sputtering surface of the target.

[0030] The service life of the target can be extended by increasing the thickness of the target, but in the later stage of sputtering with the target, the uniformity of sputtering film formation is poor.

[0031] After research, it is found that the reason is that the distribution of the magnetic field strength in the sputtering chamber is different during the sputtering process, and the sputtering surface of the target is flat, so as the sputtering process progresses, the area with stronger magnetic field intensity corresponds to The sputtered surface of the sputtered surface will form premature pits. And as the thickness of the target increases, the depth of the pits formed on the sputtering surface corresponding to the region with stronger magnetic field strength increases in the later stage of sputtering. At the same time, the target mat...

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Abstract

The invention discloses a target material, a forming method of the target material, a target material assembly and a forming method of the target material assembly. The target material is used for being loaded into a sputtering cavity. The target material comprises a sputtering face provided with a plurality of protrusions, and a groove is formed between every two adjacent protrusions. The sputtering cavity is internally provided with a plurality of first magnetic field areas and a plurality of second magnetic field areas, the magnetic field intensity of the first magnetic field areas is larger than that of the adjacent second magnetic field areas, the protrusions are used for being arranged in the first magnetic field areas, and the grooves are used for being arranged in the second magnetic field areas. Due to the target material, the service life of the target material is prolonged, and meanwhile uniformity of target material sputtering film forming can be improved.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a target and its forming method, a target component and its forming method. Background technique [0002] Usually, the sputtering surface of the target in the existing technology is a smooth plane. After the target is used many times, the sputtering surface of the target is no longer flat, but forms a plurality of pits. This is due to the difference in the angle, frequency and energy of the high-energy particles hitting the target surface during the sputtering process. When the pits continue to be hit by high-energy particles, the target will be broken down, so it is necessary to replace the target with deep pits in time. Part of the material of the replaced target is knocked off at the pit, and more target material remains in the area around the pit. Therefore, the service life of the target is short. [0003] In order to improve the life of the target, many design...

Claims

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Application Information

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IPC IPC(8): C23C14/34C23C14/35
CPCC23C14/3407C23C14/35
Inventor 姚力军潘杰相原俊夫王学泽李小萍
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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