Liquid-cooling liquid homogenizing device and liquid-cooling radiator applying same

A liquid homogenizer and radiator technology, which is applied in the direction of cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., which can solve the problem of affecting the heat dissipation effect of the cooling system, the operation quality of heating elements, and the inability to concentrate and evenly spray heating elements , The liquid working medium is not fully utilized, etc., to achieve the effect of improving heat dissipation, simple structure, and low cost

Pending Publication Date: 2018-02-02
广东西江数据科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Although the above-mentioned working fluid spray contact cooling system effectively solves the heat dissipation problem of high-power devices, this cooling system and other existing liquid spray methods still have the following disadvantages: when the liquid working fluid sprays and contacts When the heating element is used, it is impossible to ensure that the heating element is sprayed in a targeted, concentrated and uniform manner, causing the liquid working fluid to accumulate in the non-heating main part, but the heating main part cannot perform good heat dissipation, resulting in poor cooling effect, and The cooling efficiency is low, which directly affects the heat dissipation effect of the cooling system and the operating quality of the heating element
In addition, the liquid working medium has not been fully utilized, resulting in waste in disguise

Method used

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  • Liquid-cooling liquid homogenizing device and liquid-cooling radiator applying same
  • Liquid-cooling liquid homogenizing device and liquid-cooling radiator applying same
  • Liquid-cooling liquid homogenizing device and liquid-cooling radiator applying same

Examples

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Effect test

Embodiment 1

[0028] like Figure 1~4 As shown, it is a liquid-cooled homogenizer 4 of the present invention, which includes an open liquid collection box 2 for collecting liquid cooling working medium 1. The liquid collection box 2 is a rectangular box made of plastic material, and the liquid-cooled homogenizer The device 4 is used to be arranged directly above the heat dissipation fins 6 of the radiator 5 of the heating element, and the liquid collection box 2 is provided with a fixing part for fixing on the radiator 5 of the heating element. The bottom plate of the liquid collection box 2 is used for uniform The capillary homogeneous plate 3 for liquid cooling working fluid 1, the capillary homogeneous plate 3 is sealed and installed at the bottom of the liquid collection box 2, the capillary homogeneous plate 3 is plate-shaped and has a capillary structure with many pores, the capillary homogeneous plate 3 It is a key component of the liquid-cooled homogenizer 4. In this embodiment, th...

Embodiment 2

[0034] like Figure 5 As shown, the difference between this embodiment and embodiment 1 is that the structure of the capillary liquid equalizer is different. In embodiment 1, capillary through holes need to be opened on the capillary liquid equalizer, and it needs to be determined according to the arrangement of the cooling fins. The pore position of the capillary homogeneous plate is relatively complicated to manufacture. In this embodiment, the capillary leveling plate 3 is mainly composed of at least one layer of capillary porous material. When there are more than two layers of capillary porous material, the capillary leveling plate 3 is formed by stacking multiple capillary porous materials in sequence. The pores are the pores of the capillary porous material itself, which can simplify the manufacturing process, and use the block capillary porous material to replace the capillary homogeneous plate with capillary through holes. The thickness of the capillary equalizing pla...

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Abstract

The invention discloses a liquid-cooling liquid homogenizing device, which comprises an open liquid collecting box used for collecting a liquid cooling working medium, and is characterized in that a bottom plate of the liquid collecting box is a capillary liquid homogenizing plate used for equally dividing the liquid cooling working medium, the capillary liquid homogenizing plate is plate-shaped and of a capillary structure with numerous pores, the liquid collecting box is provided with a fixing component used for being fixed on a radiator of a heating device, the liquid homogenizing device isused for being fixed right above radiating fins of the radiator of the heating device, the liquid cooling working medium in the liquid collecting box is enabled to flow to the radiating fins throughthe pores under the action of gravity, be uniformly distributed to each radiating fin through a capillary action and flow along the surface of each radiating fin, and the heat at the surfaces of the radiating fins is uniformly and quickly taken away. According to the invention, the liquid cooling working medium is enabled to be quickly, comprehensively and uniformly distributed to the radiating fins of the radiator of the heating device through the capillary action, the utilization rate of the liquid cooling working medium can reach up to 100%, and targeted, centralized and uniform spraying ofthe liquid cooling working medium for the heating device can be realized.

Description

technical field [0001] The invention belongs to the field of liquid cooling and heat dissipation of heating devices, and in particular relates to a liquid cooling homogenizer and a liquid cooling radiator using the liquid cooling homogenizer, which is mainly applied to the heat dissipation of heating devices in data center servers. Background technique [0002] Today, with the rapid development of network technology, electronic components are increasingly integrated, miniaturized, and high-power, which puts forward higher requirements for the heat dissipation of electronic components. The traditional air-cooling technology can no longer meet the heat dissipation needs of high-power occasions such as existing data centers. At present, more and more data centers are gradually adopting liquid cooling methods for heat dissipation. [0003] The applicant's invention patent application (application number: 201610439358.3) discloses a working medium contact cooling system for a hig...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20809
Inventor 向军肖玮刘涛
Owner 广东西江数据科技有限公司
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