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Preparation method of metal thin film having high strength and high ductility

A metal thin film, high-strength technology, applied in the direction of metal material coating process, superimposed layer plating, ion implantation plating, etc., can solve the problems of unusable, small geometric scale of thin film materials, etc., to ensure ductility, good The effect of controllability and excellent comprehensive mechanical properties

Inactive Publication Date: 2018-01-30
NANJING UNIV
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Problems solved by technology

However, for micro-nano-scale metal films, due to the very small geometric scale of the film material, the traditional top-down (Top-down) large deformation technology cannot be used. How to obtain gradient structural features is to improve the strength and ductility of metal films. key issues

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  • Preparation method of metal thin film having high strength and high ductility
  • Preparation method of metal thin film having high strength and high ductility
  • Preparation method of metal thin film having high strength and high ductility

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specific Embodiment approach

[0016] We choose the metal Cu film as the research object, introduce the ultra-thin metal Ta film with high thermal stability as the separation layer, and separate the Cu film into different thicknesses to form a gradient structure. Using DC magnetron sputtering technology to prepare metal films with inhomogeneous gradient structure, the sputtering targets are 99.99wt% Cu, 99.9wt% Ta and 99.9wt% Ti, and the substrate is a flexible organic PI film. The thickness is 12.5 μm. Before deposition, the PI substrate was cleaned by acetone and ethanol and ultrasonicated for 20 minutes to remove surface dust and oil stains to improve the adhesion of the film to the substrate, then load the target and PI substrate, and start the vacuum chamber Vacuum.

[0017] The gradient structure Cu metal film and uniform structure Cu metal film were prepared respectively:

[0018] (a) Cu metal film with gradient structure. The gradient film has the characteristics of a gradient distribution of sin...

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Abstract

The invention discloses a preparation method of a metal thin film with both coating thickness and grain size of a gradient structure. The metal thin film has high strength and high ductility and presents excellent comprehensive mechanical performance. Different from conventional top-down methods, a new path is opened, and a bottom-up method is adopted to prepare the thin film in micro-nano scale and of the gradient structure; in other words, high-vacuum direct-current magnetron sputtering technology is utilized, an ultrathin separation layer (1nm Ta) with high thermostability is introduced ingeniously, a metal thin film is separated into a multilayer structure with gradient changing thickness, gradient distribution of grain size is further improved through medium-temperature annealing, then a non-homogeneous gradient-structure thin film with both the coating thickness and the grain size in gradient changing is obtained. A thin coating provides high strength, and a thick coating maintains high ductility, so that the gradient thin film has the advantages of high strength and high ductility. The preparation method has high suitability and can be popularized to various other metal andmetal compound thin films. The preparation method is clean, pollution-free and low in cost and has good realizing effect.

Description

technical field [0001] The invention relates to the field of thin film preparation, in particular to a method for preparing a metal thin film with high strength and high ductility. Background technique [0002] Strength and ductility are two important mechanical properties of metal materials. However, the two are contradictory. Improving the strength of a material is often at the expense of its ductility, while improving the ductility, its strength often cannot meet the requirements of use. . Therefore, how to improve the strength and ductility of materials at the same time is one of the scientific problems that material workers need to solve urgently. A large number of studies have found that the grain-gradient structure can well solve the conflicting problems of strength and ductility. For bulk metallic materials, a grain-gradient structure can be obtained through the top-down large deformation method, that is, from the surface to the interior of the material, the grain ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/20C23C14/02C23C14/35C23C28/02
Inventor 操振华胡坤马玉洁孙超孟祥康
Owner NANJING UNIV
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