Special radiator fan structure for microelectronic equipment

Abstract

The invention discloses a special radiator fan structure for microelectronic equipment. The special radiator fan structure comprises a bottom connecting plate, a fan, a first radiator fan and a secondradiator fan, wherein the bottom connecting plate is mounted at the bottom of the first radiator fan; the first radiator fan and the second radiator fan are fixedly connected together; a flow exchange gap is formed at the joint of the first radiator fan and the second radiator fan; the fan is mounted at the top of the second radiator fan; a conduction ring is arranged in the middle of each of thefirst radiator fan and the second radiator fan; each conduction ring sleeves an inner connecting ring; radiation pieces are uniformly arranged on the surface of each inner connecting ring and embedded into rectangular grooves of the corresponding conduction ring; an impeller is mounted in the middle of the interior of each conduction ring; the impellers are driven by a rotating shaft to rotate; adriving motor is connected to the top of the rotating shaft; the rotating shaft penetrates the driving motor and is connected with fan blades; and the driving motor and the fan blades are arranged inthe fan. Owing to the multi-layer fan structure, multi-stage progressive air intake and exhaust in the structure are realized; and meanwhile, the heat dissipation area is increased through arc-shapedfins, and the heat dissipation efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of microelectronic equipment, in particular to a cooling fan structure dedicated to microelectronic equipment. Background technique [0002] Microelectronics technology is a new technology developed along with integrated circuits, especially VLSIs. The theoretical basis of its development is modern physics established from the end of the 19th century to the 1930s. Microelectronics technology includes a series of specialized technologies such as system circuit design, device physics, process technology, material preparation, automatic testing, packaging, and assembly. , Microelectronics technology is the sum of various process technologies in microelectronics. Due to the small size and high power operation of microelectronic equipment, it generates very high heat, and excessive heat will easily reduce the operating efficiency of microelectronic equipment such as chips. , At the same time, it is easy to burn ...

AI Technical Summary

Problems solved by technology

The theoretical basis of its development is modern physics established from the end of the 19th century to the 1930s. Microelectronics technology includes a series of specialized technologies such as system circuit design, device physics, process technology, material preparation, automatic testing, packaging, and assembly. , Microelectronics technology is the sum of various process technologies in microelectronics. Due to the small size and high power operation of microelectronic equipment, it generates very high heat, and excessive heat will easily reduce the operating efficiency of microelectronic equipment such as chips. At the same time, it is easy to burn the equipment, which is very important for the heat dissipation of microelectronic equipment. At this stage, most of them use heat sinks for heat dissipation, but the heat dissipation effect is poor. The cost of good heat dissipation radiators is too high, the volume is large, and the installation is complicated

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